参数资料
| 型号： | LT3082IST#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 13/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .2A SOT223-3 |
| 标准包装： | 2,000 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 可调 |
| 输入电压： | 1.2 V ~ 40 V |
| 电压 - 压降（标准）： | 1.3V @ 200mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA（最小值） |
| 电流 - 限制（最小）： | 200mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-261-4，TO-261AA |
| 供应商设备封装： | SOT-223 |
| 包装： | 带卷 (TR) |
LT3082
APPLICATIONS INFORMATION
Tables 3 through 5 list thermal resistance as a function
of copper areas in a ?xed board size. All measurements
were taken in still air on a 4-layer FR-4 board with 1oz
solid internal planes and 2oz external trace planes with a
total ?nished board thickness of 1.6mm.
PCB layers, copper weight, board layout and thermal vias
affect the resultant thermal resistance. Please reference
JEDEC standard JESD51-7 for further information on high
thermal conductivity test boards. Achieving low thermal
resistance necessitates attention to detail and careful layout.
Table 3. DD Package, 8-Lead DFN
COPPER AREA
TOPSIDE* BACKSIDE BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
Demo circuit 1447A’s board layout using multiple inner
V OUT planes and multiple thermal vias achieves 28°C/W
performance for the DFN package.
2500mm 2
2500mm 2
2500mm 2
25°C/W
Calculating Junction Temperature
1000mm 2 2500mm 2
225mm 2 2500mm 2
100mm 2 2500mm 2
*Device is mounted on topside
2500mm 2
2500mm 2
2500mm 2
25°C/W
28°C/W
32°C/W
Example: Given an industrial factory application with an
input voltage of 15V ±10%, an output voltage of 12V ±5%,
an output current of 200mA and a maximum ambient
temperature of 50°C, what would be the maximum junc-
Table 4. TS8 Package, 8-Lead SOT-23
tion temperature for a DFN package?
COPPER AREA
THERMAL RESISTANCE
The total circuit power equals:
TOPSIDE*
2500mm 2
1000mm 2
225mm 2
BACKSIDE
2500mm 2
2500mm 2
2500mm 2
BOARD AREA
2500mm 2
2500mm 2
2500mm 2
(JUNCTION-TO-AMBIENT)
54°C/W
54°C/W
57°C/W
P TOTAL = (V IN – V OUT )(I OUT )
The SET pin current is negligible and can be ignored.
V IN(MAX CONTINUOUS) = 16.5 (15V + 10%)
100mm 2 2500mm 2
*Device is mounted on topside
2500mm 2
63°C/W
V OUT(MIN CONTINUOUS) = 11.4V (12V – 5%)
I OUT = 200mA
Table 5. ST Package, 3-Lead SOT-223
Power dissipation under these conditions equals:
COPPER AREA
TOPSIDE* BACKSIDE
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
P TOTAL = (16.5 – 11.4V)(200mA) = 1.02W
2500mm 2
1000mm 2
225mm 2
100mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
20°C/W
20°C/W
24°C/W
29°C/W
Junction temperature equals:
T J = T A + P TOTAL ? θ JA
T J = 50°C + (1.02W ? 30°C/W) = 80.6°C
*Device is mounted on topside
For further information on thermal resistance and using thermal information,
In this example, junction temperature is below the maxi-
mum rating, ensuring reliable operation.
refer to JEDEC standard JESD51, notably JESD51-12.
3082f
13
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