参数资料
| 型号： | LT3083IDF#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 15/28页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 3A 12-DFN |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 可调至 23V |
| 输入电压： | 1.2 V ~ 23 V |
| 电压 - 压降（标准）： | 1.25V @ 3A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 3A |
| 电流 - 限制（最小）： | 3A |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-WFDFN 裸露焊盘 |
| 供应商设备封装： | 12-DFN-EP（4x4） |
| 包装： | 带卷 (TR) |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页当前第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页
LT3083
APPLICATIONS INFORMATION
THERMAL RESISTANCE
THERMAL RESISTANCE
THERMAL RESISTANCE
Thermal Considerations
The LT3083’s internal power and thermal limiting circuitry
protects itself under overload conditions. For continuous
normal load conditions, do not exceed the 125°C maximum
junction temperature. Carefully consider all sources of
thermal resistance from junction-to-ambient. This includes
(but is not limited to) junction-to-case, case-to-heat sink
interface, heat sink resistance or circuit board-to-ambient
as the application dictates. Consider all additional, adjacent
heat generating sources in proximity on the PCB.
Surface mount packages provide the necessary heat
sinking by using the heat spreading capabilities of the
PC board, copper traces, and planes. Surface mount heat
sinks, plated through-holes and solder-filled vias can also
spread the heat generated by power devices.
Junction-to-case thermal resistance is specified from the
IC junction to the bottom of the case directly, or the bottom
of the pin most directly in the heat path. This is the lowest
thermal resistance path for heat flow. Only proper device
mounting ensures the best possible thermal flow from this
area of the packages to the heat sinking material.
Note that the exposed pad of the DFN and TSSOP pack-
ages and the tab of the DD-PAK and TO-220 packages
are electrically connected to the output (V OUT ).
Tables 3 through 5 list thermal resistance as a function
of copper areas on a fixed board size. All measurements
were taken in still air on a 4-layer FR-4 board with 1oz
solid internal planes and 2oz external trace planes with a
total finished board thickness of 1.6mm. Layers are not
connected electrically or thermally.
Table 3. DF Package, 12-Lead DFN
COPPER AREA
TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm 2 2500mm 2 2500mm 2 18°C/W
1000mm 2 2500mm 2 2500mm 2 22°C/W
Table 4. FE Package, 16-Lead TSSOP
COPPER AREA
TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm 2 2500mm 2 2500mm 2 16°C/W
1000mm 2 2500mm 2 2500mm 2 20°C/W
225mm 2 2500mm 2 2500mm 2 26°C/W
100mm 2 2500mm 2 2500mm 2 32°C/W
*Device is mounted on topside.
Table 5. Q Package, 5-Lead DD-PAK
COPPER AREA
TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500mm 2 2500mm 2 2500mm 2 13°C/W
1000mm 2 2500mm 2 2500mm 2 14°C/W
125mm 2 2500mm 2 2500mm 2 16°C/W
*Device is mounted on topside.
T Package, 5-Lead TO-220
Thermal Resistance (Junction-to-Case) = 3°C/W
For further information on thermal resistance and using
thermal information, refer to JEDEC standard JESD51,
notably JESD51-12.
PCB layers, copper weight, board layout and thermal vias
affect the resultant thermal resistance. Tables 3 through 5
provide thermal resistance numbers for best-case 4-layer
boards with 1oz internal and 2oz external copper. Modern,
multilayer PCBs may not be able to achieve quite the same
level performance as found in these tables.
Calculating Junction Temperature
Example: Given an output voltage of 0.9V, a V CONTROL
voltage of 3.3V ±10%, an IN voltage of 1.5V ±5%, output
current range from 10mA to 3A and a maximum ambient
temperature of 50°C, what will the maximum junction
temperature be for the DD-PAK on a 2500mm 2 board with
topside copper of 1000mm 2 ?
225mm 2
100mm 2
2500mm 2
2500mm 2
2500mm 2
2500mm 2
29°C/W
35°C/W
*Device is mounted on topside.
3083fa
15
相关PDF资料 |
PDF描述 |
|---|---|
| LT3071EUFD#TRPBF | IC REG LDO ADJ 5A 28QFN |
| LT1085IM-3.6 | IC REG LDO 3.6V 3A DDPAK-3 |
| LT1084CP-5#PBF | IC REG LDO 5V 5A TO-3P-3 |
| ASC36DRYN | CONN EDGECARD 72POS .100 DIP SLD |
| ASC35DRYI | CONN EDGECARD 70POS .100 DIP SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| LT3083IFE | 制造商:LINER 制造商全称:Linear Technology 功能描述:Adjustable 3A Single Resistor Low Dropout Regulator |
| LT3083IFE#PBF | 功能描述:IC REG LDO ADJ 3A 16-TSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.5V 输入电压:2.5 V ~ 5.5 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:300mA（最小值） 电流 - 限制（最小）:360mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) |
| LT3083IFE#PBF-ES | 制造商:Linear Technology 功能描述:LDO Regulator Pos 0V to 23V 3A 16-Pin TSSOP EP |
| LT3083IFE#TRPBF | 功能描述:IC REG LDO ADJ 3A 16-TSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.5V 输入电压:2.5 V ~ 5.5 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:300mA（最小值） 电流 - 限制（最小）:360mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) |
| LT3083IFE#TRPBF-ES | 制造商:Linear Technology 功能描述:LDO Regulator Pos 0V to 23V 3A 16-Pin TSSOP EP T/R |
发布紧急采购，3分钟左右您将得到回复。