参数资料
| 型号： | LT3085EDCB#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 15/28页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .5A 6-DFN |
| 产品培训模块： | More Information on LDOs |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 可调 |
| 输入电压： | 1.2 V ~ 36 V |
| 电压 - 压降（标准）： | 1.35V @ 500mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 500mA |
| 电流 - 限制（最小）： | 500mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WFDFN 裸露焊盘 |
| 供应商设备封装： | 8-DFN-EP（3x3） |
| 包装： | 带卷 (TR) |
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LT3085
APPLICATIONS INFORMATION
If the LT3085 is con?gured as a three-terminal (single supply)
regulator with IN and V CONTROL shorted together, the internal
diode of the IN pin will protect the V CONTROL pin.
Like any other regulator, exceeding the maximum input-
to-output differential causes internal transistors to break
down and then none of the internal protection circuitry
is functional.
Thermal Considerations
provide better performance than found in these tables.
For example, a 4-layer, 1 ounce copper PCB board with
5 thermal vias from the DFN or MSOP exposed backside
pad to inner layers (connected to V OUT ) achieves 40°C/W
thermal resistance. Demo circuit 1401A’s board layout
achieves this 40°C/W performance. This is approximately
a 45% improvement over the numbers shown in Tables
2 and 3.
Table 2. MSE Package, 8-Lead MSOP
The LT3085 has internal power and thermal limiting cir-
COPPER AREA
THERMAL RESISTANCE
cuitry designed to protect it under overload conditions.
For continuous normal load conditions, maximum junc-
tion temperature must not be exceeded. It is important
to give consideration to all sources of thermal resistance
from junction to ambient. This includes junction-to-case,
TOPSIDE*
2500mm 2
1000mm 2
225mm 2
100mm 2
BACKSIDE
2500mm 2
2500mm 2
2500mm 2
2500mm 2
BOARD AREA
2500mm 2
2500mm 2
2500mm 2
2500mm 2
(JUNCTION-TO-AMBIENT)
55°C/W
57°C/W
60°C/W
65°C/W
case-to-heat sink interface, heat sink resistance or circuit
board-to-ambient as the application dictates. Additional
heat sources nearby must also be considered.
*Device is mounted on topside
Table 3. DCB Package, 6-Lead DFN
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Surface mount heat sinks and
plated through-holes can also be used to spread the heat
generated by power devices. Boards speci?ed in thermal
resistance tables have no vias on plated through-holes
COPPER AREA
TOPSIDE* BACKSIDE
2500mm 2 2500mm 2
1000mm 2 2500mm 2
225mm 2 2500mm 2
100mm 2 2500mm 2
BOARD AREA
2500mm 2
2500mm 2
2500mm 2
2500mm 2
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
68°C/W
70°C/W
73°C/W
78°C/W
from topside to backside.
Junction-to-case thermal resistance is speci?ed from
the IC junction to the bottom of the case directly below
the die. This is the lowest resistance path for heat ?ow.
Proper mounting is required to ensure the best possible
thermal ?ow from this area of the package to the heat
sinking material. Note that the Exposed Pad is electrically
connected to the output.
The following tables list thermal resistance for several
different copper areas given a ?xed board size. All mea-
surements were taken in still air on two-sided 1/16” FR-4
board with one ounce copper.
PCB layers, copper weight, board layout and thermal vias
affect the resultant thermal resistance. Although Tables
2 and 3 provide thermal resistance numbers for 2-layer
board with 1 ounce copper, modern multi-layer PCBs
*Device is mounted on topside
For future information on the thermal resistance and using thermal
information, refer to JEDEC standard JESD51, notably JESD51-12.
Calculating Junction Temperature
Example: Given an output voltage of 0.9V, a V CONTROL
voltage of 3.3V ±10%, an IN voltage of 1.5V ±5%, output
current range from 1mA to 0.5A and a maximum ambi-
ent temperature of 50°C, what will the maximum junction
temperature be for the DFN package on a 2500mm 2 board
with topside copper area of 500mm 2 ?
The power in the drive circuit equals:
P DRIVE = (V CONTROL – V OUT )(I CONTROL )
where I CONTROL is equal to I OUT /60. I CONTROL is a function
of output current. A curve of I CONTROL vs I OUT can be found
in the Typical Performance Characteristics curves.
3085fb
15
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT3085EMS8E | 制造商:Linear Technology 功能描述:LDO Regulator Pos 0V to 36V 0.5A 8-Pin MSOP EP |
| LT3085EMS8E#PBF | 功能描述:IC REG LDO ADJ .5A 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 产品培训模块:MIC5365/66 Ultra-small LDO Regulators 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:最高 5.5V 电压 - 压降（标准）:0.155V @ 150mA 稳压器数量:1 电流 - 输出:150mA 电流 - 限制（最小）:200mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:4-UDFN 裸露焊盘，4-TMLF? 供应商设备封装:4-TMLF?（1x1） 包装:Digi-Reel® 其它名称:576-3192-6 |
| LT3085EMS8E#TRPBF | 功能描述:IC REG LDO ADJ .5A 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:800 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.5V 输入电压:最高 16V 电压 - 压降（标准）:0.7V @ 4A 稳压器数量:1 电流 - 输出:4A 电流 - 限制（最小）:4.2A 工作温度:0°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-263-6，D²Pak（5 引线+接片），TO-263BA 供应商设备封装:TO-263-5 包装:带卷 (TR) 其它名称:AP1184K525L-13AP1184K525LDITR |
| LT3085EMS8EPBF | 制造商:Linear Technology 功能描述:LDO Regulator Adj. 0.5A Resistor MSOP8EP |
| LT3085EMS8E-PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:Adjustable 500mA Single Resistor Low Dropout Regulator |
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