- 您现在的位置：买卖IC网 > PDF目录22244 > LT3092ITS8#TRMPBF (Linear Technology)IC PROG CURRENT SOURCE TSOT23-8 PDF资料下载
参数资料
| 型号： | LT3092ITS8#TRMPBF |
| 厂商： | Linear Technology |
| 文件页数： | 13/22页 |
| 文件大小： | 249K |
| 描述： | IC PROG CURRENT SOURCE TSOT23-8 |
| 标准包装： | 500 |
| 功能： | 电流源 |
| 精确度： | ±1% |
| 输入电压： | 1.2 V ~ 40 V |
| 电流 - 输出： | 200mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-8 薄型，TSOT-23-8 |
| 供应商设备封装： | TSOT-23-8 |
| 包装： | 带卷 (TR) |
LT3092
13
3092fb
APPLICATIONS INFORMATION
interface, heat sink resistance or circuit board-to-ambient
as the application dictates. Consider all additional, adjacent
heat generating sources in proximity on the PCB.
Surface mount packages provide the necessary heat
sinking by using the heat spreading capabilities of the
PC board, copper traces and planes. Surface mount heat
sinks, plated through-holes and solder lled vias can also
spread the heat generated by power devices.
Junction-to-case thermal resistance is speci ed from the
IC junction to the bottom of the case directly, or the bottom
of the pin most directly, in the heat path. This is the lowest
thermal resistance path for heat ow. Only proper device
mounting ensures the best possible thermal ow from this
area of the package to the heat sinking material.
Note that the Exposed Pad of the DFN package and the
Tab of the SOT-223 package are electrically connected
to the output (V
OUT
).
The following tables list thermal resistance as a function
of copper areas in a xed board size. All measurements
were taken in still air on a four-layer FR-4 board with 1oz
solid internal planes and 2oz external trace planes with a
total nished board thickness of 1.6mm.
PCB layers, copper weight, board layout and thermal vias
affect the resultant thermal resistance. Please reference
JEDEC standard JESD51-7 for further information on high
thermal conductivity test boards. Achieving low thermal
resistance necessitates attention to detail and careful layout.
Figure 8. Connect Two LT3092s for Higher Current
Figure 9. Parallel Devices
3092 F08
1.33?/DIV>
1.33?/DIV>
300?/DIV>
300?/DIV>
I
OUT
I
OUT
, 300mA
+
LT3092
10糀
10糀
+
LT3092
20k
20k
IN
IN
SET
SET
OUT
OUT
OUT
OUT
3092 F09
I
OUT
I
OUT
, 400mA
+
LT3092
10糀
+
LT3092
10糀
R
2.5?/DIV>
R
x
50k
40m?
40m?
*40m?PC BOARD TRACE
1V
IN
IN
SET
SET
R
V
R
x
IN MAX
=
(
)
"
%
90
相关PDF资料 |
PDF描述 |
|---|---|
| LT3092IDD#PBF | IC PROG CURRENT SOURCE 8DFN |
| LT3092EST#TRPBF | IC PROG CURRENT SOURCE SOT223-3 |
| AD8210YRZ-REEL | IC CURRENT MONITOR 0.5% 8SOIC |
| AD8212WYRMZ-RL | IC CURRENT MONITOR 8MSOP |
| LT3092EDD#TRPBF | IC PROG CURRENT SOURCE 8DFN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| LT3092ITS8TRPBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:200mA 2-Terminal Programmable Current Source |
| LT3092MPST | 制造商:Linear Technology 功能描述:Adjustable Current Source 4-Pin(3+Tab) SOT-223 |
| LT3092MPST#PBF | 功能描述:IC CURRENT SOURCE PROGR SOT223-3 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳流/电流管理 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 功能:电流开关 检测方法:- 精确度:±10% 输入电压:1.7 V ~ 5.5 V 电流 - 输出:600mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:10-UFQFN 供应商设备封装:10-UTQFN（1.4x1.8） 包装:管件 |
| LT3092MPST#TR | 制造商:Linear Technology 功能描述:Adjustable Current Source 4-Pin(3+Tab) SOT-223 T/R |
| LT3092MPST#TRPBF | 功能描述:IC PROG CURRENT SOURCE SOT223-3 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳流/电流管理 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 功能:电流开关 检测方法:- 精确度:±10% 输入电压:1.7 V ~ 5.5 V 电流 - 输出:600mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:10-UFQFN 供应商设备封装:10-UTQFN（1.4x1.8） 包装:管件 |
发布紧急采购，3分钟左右您将得到回复。