参数资料
型号: LT3479EFE#PBF
厂商: Linear Technology
文件页数: 18/20页
文件大小: 0K
描述: IC REG BOOST INV ADJ 3A 16TSSOP
标准包装: 95
类型: 升压(升压),反相
输出类型: 可调式
输出数: 1
输出电压: 1.24 V ~ 42 V
输入电压: 2.5 V ~ 24 V
PWM 型: 电流模式
频率 - 开关: 200kHz ~ 3.5MHz
电流 - 输出: 3A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm)裸露焊盘
包装: 管件
供应商设备封装: 16-TSSOP-EP
产品目录页面: 1331 (CN2011-ZH PDF)
LT3479
PACKAGE DESCRIPTION
DE Package
14-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1708 Rev B)
0.70 ± 0.05
3.60 ± 0.05
2.20 ± 0.05
3.30 ± 0.05
1.70 ± 0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
3.00 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ± 0.10
(2 SIDES)
R = 0.05
8
R = 0.115
TYP
14
0.40 ± 0.10
TYP
3.00 ± 0.10
3.30 ± 0.10
(2 SIDES)
1.70 ± 0.10
PIN 1 NOTCH
PIN 1
TOP MARK
(SEE NOTE 6)
7
1
R = 0.20 OR
0.35 × 45 °
CHAMFER
(DE14) DFN 0806 REV B
0.200 REF
0.75 ± 0.05
0.00 – 0.05
0.25 ± 0.05
0.50 BSC
3.00 REF
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3479fc
18
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