参数资料
型号: LT3486EFE#TRPBF
厂商: Linear Technology
文件页数: 18/20页
文件大小: 0K
描述: IC LED DRVR WHITE BCKLGT 16TSSOP
标准包装: 2,500
恒定电流:
拓扑: PWM,升压(升压)
输出数: 2
内部驱动器:
类型 - 主要: 车载,背光
类型 - 次要: 白色 LED
频率: 200kHz ~ 2.25MHz
电源电压: 2.5 V ~ 24 V
输出电压: 36V
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm)裸露焊盘
供应商设备封装: 16-TSSOP-EP
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
LT3486
PACKAGE DESCRIPTION
DHC Package
16-Lead Plastic DFN (5mm × 3mm)
(Reference LTC DWG # 05-08-1706)
0.65 ± 0.05
5.00 ± 0.10
(2 SIDES)
R = 0.20
TYP
9
R = 0.115
TYP
16
0.40 ± 0.10
3.50 ± 0.05
1.65 ± 0.05
(2 SIDES) PACKAGE
2.20 ± 0.05 OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
0.25 ± 0.05 0.200 REF
0.50 BSC
4.40 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ± 0.10 1.65 ± 0.10
(2 SIDES) (2 SIDES)
0.75 ± 0.05
0.00 – 0.05
8 1
0.25 ± 0.05
0.50 BSC
4.40 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
PIN 1
NOTCH
(DHC16) DFN 1103
(Reference LTC DWG # 05-08-1663 Rev I)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
FE Package
16-Lead Plastic TSSOP (4.4mm)
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC Pad # 05-08-1663 BC
Exposed DWG Variation Rev I)
Exposed Pad Variation BC
3.58
(.141)
4.90 – 5.10*
(.193 – .201)
3.58
(.141)
16 1514 13 12 11
10 9
0.48
(.019)
REF
6.60 ± 0.10
4.50 ± 0.10
SEE NOTE 4
2.94
(.116)
0.45 ± 0.05
1.05 ± 0.10
DETAIL B
2.94
(.116)
6.40
(.252)
BSC
0.51
(.020)
REF
DETAIL B IS THE PART OF
THE LEAD FRAME FEATURE
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7 8
4.30 – 4.50*
(.169 – .177)
0.25
REF
0 ° – 8 °
1.10
(.0433)
MAX
MILLIMETERS
(INCHES)
0.195 – 0.30
(.0077 – .0118)
0.09–0.20 0.50 – 0.75
(.0035 – .0079) (.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
0.65
(.0256) 0.05 – 0.15
BSC (.002 – .006)
FE16 (BC) TSSOP REV I 1210
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3486fe
18
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