参数资料
型号: LT3693IMSE#PBF
厂商: Linear Technology
文件页数: 22/24页
文件大小: 0K
描述: IC REG BUCK ADJ 3.5A 10MSOP
标准包装: 50
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.79 V ~ 30 V
输入电压: 3.6 V ~ 36 V
PWM 型: 电流模式
频率 - 开关: 200kHz ~ 2.45MHz
电流 - 输出: 3.5A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)裸露焊盘
包装: 管件
供应商设备封装: 10-MSOP 裸露焊盘
产品目录页面: 1332 (CN2011-ZH PDF)
LT3693
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ± 0.05
3.50 ± 0.05 1.65 ± 0.05
2.15 ± 0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
1.65 ± 0.10
(2 SIDES)
R = 0.115
TYP
6
10
0.38 ± 0.10
(DD) DFN 1103
0.200 REF
0.75 ± 0.05
5
1
0.25 ± 0.05
0.50 BSC
2.38 ± 0.10
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3693f
22
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