参数资料
型号: LT3970EMS#TRPBF
厂商: Linear Technology
文件页数: 19/22页
文件大小: 0K
描述: IC REG BUCK ADJ 0.35A 10MSOP
标准包装: 2,500
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 1.21 V ~ 25 V
输入电压: 4.2 V ~ 40 V
PWM 型: 电流模式,Burst Mode?
频率 - 开关: 200kHz ~ 2.25MHz
电流 - 输出: 350mA
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
包装: 带卷 (TR)
供应商设备封装: 10-MSOP
LT3970 Series
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DDB Package
10-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1722 Rev ?)
0.64 ±0.05
(2 SIDES)
0.70 ±0.05
3.00 ±0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
6
10
0.40 ± 0.10
5
2.55 ±0.05
1.15 ±0.05
0.25 ± 0.05
0.50 BSC
PACKAGE
OUTLINE
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.64 ± 0.05
(2 SIDES)
0.25 ± 0.05
1
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
(DDB10) DFN 0905 REV ?
0.50 BSC
2.39 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0 – 0.05
2.39 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
19
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
3970fc
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LT3970HMS#PBF 制造商:Linear Technology 功能描述:IC REG BUCK ADJ 0.35A 10MSOP 制造商:Linear Technology 功能描述:IC, STEP DOWN REG, 200KHZ-2.2MHZ, MSOP10 制造商:Linear Technology 功能描述:SWITCHING REG, BUCK, ADJ, 2.2MHZ, MSOP10, Primary Input Voltage:40V, No. of Outputs:1, Output Current:350mA, No. of Pins:10, Operating Temperature Min:-40C, Operating Temperature Max:150C, Package / Case:10-MSOP , RoHS Compliant: Yes
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