参数资料
型号: LT3973EDD#PBF
厂商: Linear Technology
文件页数: 18/24页
文件大小: 0K
描述: IC REG BUCK ADJ 0.75A 10DFN
标准包装: 121
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 1.21 V ~ 24 V
输入电压: 4.2 V ~ 42 V
PWM 型: 电流模式,Burst Mode?
频率 - 开关: 195kHz ~ 2.15MHz
电流 - 输出: 750mA
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
包装: 管件
供应商设备封装: 10-DFN(3x3)
LT3973/LT3973-3.3/LT3973-5
APPLICATIONS INFORMATION
If the EN/UVLO pin is grounded, the SW pin current will
drop to 0.75μA. However, if the V IN pin is grounded while
the output is held high, regardless of EN/UVLO, parasitic
diodes inside the LT3973 can pull current from the output
through the SW pin and the V IN pin. Figure 8 shows a circuit
that will run only when the input voltage is present and that
protects against a shorted or reversed input.
EN/UVLO
V IN
GND
1
2
3
4
5
10
9
8
7
6
GND
PG
PCB Layout
VIAS TO LOCAL GROUND PLANE
ForproperoperationandminimumEMI,caremustbetaken
during printed circuit board layout. Figure 9 shows the rec-
ommended component placement with trace, ground plane
and via locations. Note that large, switched currents flow in
the LT3973’s V IN and SW pins, the internal catch diode and
the input capacitor. The loop formed by these components
should be as small as possible. These components, along
with the inductor and output capacitor, should be placed on
the same side of the circuit board, and their connections
should be made on that layer. Place a local, unbroken ground
plane below these components. The SW and BOOST nodes
should be as small as possible. Finally, keep the FB nodes
small so that the ground traces will shield them from the
SW and BOOST nodes. The exposed pad on the bottom
must be soldered to ground so that the pad acts as a heat
sink. To keep thermal resistance low, extend the ground
plane as much as possible, and add thermal vias under
and near the LT3973 to additional ground planes within
the circuit board and on the bottom side.
Hot Plugging Safely
The small size, robustness and low impedance of ceramic
capacitors make them an attractive option for the input
bypass capacitor of LT3973 circuits. However, these ca-
pacitors can cause problems if the LT3973 is plugged into
a live supply. The low loss ceramic capacitor, combined
with stray inductance in series with the power source,
forms an under damped tank circuit, and the voltage at
the V IN pin of the LT3973 can ring to twice the nominal
input voltage, possibly exceeding the LT3973’s rating and
damaging the part. If the input supply is poorly controlled
or the user will be plugging the LT3973 into an energized
supply, the input network should be designed to prevent
this overshoot. See Application Note 88 for a complete
discussion.
GND V OUT
3973 F09
VIAS TO V OUT
Figure 9. A Good PCB Layout Ensures Proper, Low EMI Operation
High Temperature Considerations
For higher ambient temperatures, care should be taken
in the layout of the PCB to ensure good heat sinking of
the LT3973. The exposed pad on the bottom must be
soldered to a ground plane. This ground should be tied to
large copper layers below with thermal vias; these layers
will spread the heat dissipated by the LT3973. Placing
additional vias can reduce thermal resistance further. The
maximum load current should be derated as the ambient
temperature approaches the maximum junction rating.
Power dissipation within the LT3973 can be estimated by
calculating the total power loss from an efficiency measure-
ment and subtracting inductor loss. The die temperature
is calculated by multiplying the LT3973 power dissipation
by the thermal resistance from junction to ambient.
Finally, be aware that at high ambient temperatures the
internal Schottky diode will have significant leakage cur-
rent (see the Typical Performance Characteristics section)
increasing the quiescent current of the LT3973 converter.
Other Linear Technology Publications
Application Notes 19, 35 and 44 contain more detailed
descriptions and design information for buck regulators
and other switching regulators. The LT1376 data sheet
has a more extensive discussion of output ripple, loop
compensation and stability testing. Design Note 100
shows how to generate a bipolar output supply using a
buck regulator.
3973fa
18
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LT3973EMSE#PBF 功能描述:IC REG BUCK ADJ 0.75A 10MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:250 系列:- 类型:降压(降压) 输出类型:固定 输出数:1 输出电压:1.2V 输入电压:2.05 V ~ 6 V PWM 型:电压模式 频率 - 开关:2MHz 电流 - 输出:500mA 同步整流器:是 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:6-UFDFN 包装:带卷 (TR) 供应商设备封装:6-SON(1.45x1) 产品目录页面:1032 (CN2011-ZH PDF) 其它名称:296-25628-2
LT3973EMSE#TRPBF 功能描述:IC REG BUCK ADJ 0.75A 10MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:2,500 系列:- 类型:降压(降压) 输出类型:固定 输出数:1 输出电压:1.2V,1.5V,1.8V,2.5V 输入电压:2.7 V ~ 20 V PWM 型:- 频率 - 开关:- 电流 - 输出:50mA 同步整流器:是 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:10-TFSOP,10-MSOP(0.118",3.00mm 宽)裸露焊盘 包装:带卷 (TR) 供应商设备封装:10-MSOP 裸露焊盘
LT3973EMSE-3.3#PBF 功能描述:IC REG BUCK 3.3V 0.75A 10MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:250 系列:- 类型:降压(降压) 输出类型:固定 输出数:1 输出电压:1.2V 输入电压:2.05 V ~ 6 V PWM 型:电压模式 频率 - 开关:2MHz 电流 - 输出:500mA 同步整流器:是 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:6-UFDFN 包装:带卷 (TR) 供应商设备封装:6-SON(1.45x1) 产品目录页面:1032 (CN2011-ZH PDF) 其它名称:296-25628-2
LT3973EMSE-3.3#TRPBF 功能描述:IC REG BUCK 3.3V 0.75A 10MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:2,500 系列:- 类型:降压(降压) 输出类型:固定 输出数:1 输出电压:1.2V,1.5V,1.8V,2.5V 输入电压:2.7 V ~ 20 V PWM 型:- 频率 - 开关:- 电流 - 输出:50mA 同步整流器:是 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:10-TFSOP,10-MSOP(0.118",3.00mm 宽)裸露焊盘 包装:带卷 (TR) 供应商设备封装:10-MSOP 裸露焊盘
LT3973EMSE-5#PBF 功能描述:IC REG BUCK 5V 0.75A 10MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:250 系列:- 类型:降压(降压) 输出类型:固定 输出数:1 输出电压:1.2V 输入电压:2.05 V ~ 6 V PWM 型:电压模式 频率 - 开关:2MHz 电流 - 输出:500mA 同步整流器:是 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:6-UFDFN 包装:带卷 (TR) 供应商设备封装:6-SON(1.45x1) 产品目录页面:1032 (CN2011-ZH PDF) 其它名称:296-25628-2