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参数资料
| 型号： | LT6551IMS#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 4/16页 |
| 文件大小： | 0K |
| 描述： | IC AMP VIDEO QUAD 3.3V 10-MSOP |
| 标准包装： | 2,500 |
| 应用： | 电压反馈 |
| 输出类型： | 满摆幅 |
| 电路数： | 4 |
| -3db带宽： | 90MHz |
| 转换速率： | 600 V/µs |
| 电流 - 电源： | 8.5mA |
| 电流 - 输出 / 通道： | 60mA |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 12.6 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 带卷 (TR) |
LT6550/LT6551
12
65501fa
Power Dissipation
The LT6550/LT6551, enhanced
θJA MS package, has
Pin 5 (VEE for the LT6550 and GND for the LT6551) fused
to the lead frame. This thermal connection increases the
efficiency of the PC board as a heat sink. The PCB material
can be very effective at transmitting heat between the pad
area attached to Pin 5 and a ground or power plane layer.
Copper board stiffeners and plated through holes can also
be used to spread the heat generated by the device. Table 1
lists the thermal resistance for several different board
sizes and copper areas. All measurements were taken on
3/32” FR-4 board with 2oz copper. This data can be used
as a rough guideline in estimating thermal resistance. The
thermal resistance for each application will be affected by
thermal interactions with other components as well as
board size and shape.
Table 1. Fused 10-Lead MSOP Package
COPPER AREA
TOPSIDE*
BACKSIDE
BOARD AREA
THERMAL RESISTANCE
(mm2)
(JUNTION-TO-AMBIENT)
540
2500
110
°C/W
100
2500
120
°C/W
100
0
2500
130
°C/W
30
0
2500
135
°C/W
0
2500
140
°C/W
*Device is mounted on topside.
As an example, calculate the junction temperature for the
circuit in Figure 2 assuming an 85
°Cambienttemperature.
The device dissipation can be found by measuring the
supply current, calculating the total dissipation and then
subtracting the dissipation in the load.
The dissipation for the amplifiers is:
PD = (106mA)(5V) – 4 (2.5V)2/150 = 363mW
The total package power dissipation is 363mW. When a
2500 sq mm PC board with 540 sq mm of 2oz copper on
top and bottom is used, the thermal resistance is
110
°C/W. The junction temperature (TJ) is:
TJ = (363mW)(110°C/W) + 85°C = 125°C
The maximum junction temperature for the LT6551 is
150
°C so the heat sinking capability of the board is
adequate for the application.
Figure 2. Calculating Junction Temperature
+
–
5V
1.25V
OA
450
450
+
–
OA
450
450
+
–
OA
450
450
+
–
GND
OA
450
450
75
75
75
75
75
75
75
75
LT6551
6551 F02
APPLICATIO S I FOR ATIO
WU
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT6552 | 制造商:LINER 制造商全称:Linear Technology 功能描述:3.3V Single Supply Video Difference Amplifier |
| LT6552CDD | 功能描述:IC AMP VIDEO DIFF 3.3V 8-DFN RoHS:否 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 标准包装:1,000 系列:- 应用:驱动器 输出类型:差分 电路数:3 -3db带宽:350MHz 转换速率:1000 V/µs 电流 - 电源:14.5mA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):5 V ~ 12 V，±2.5 V ~ 6 V 安装类型:表面贴装 封装/外壳:20-VFQFN 裸露焊盘 供应商设备封装:20-QFN 裸露焊盘（4x4） 包装:带卷 (TR) |
| LT6552CDD#PBF | 功能描述:IC AMP VIDEO DIFF 3.3V 8-DFN RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| LT6552CDD#TR | 功能描述:IC OPAMP VID DIFF SGL 3.3V 8-DFN RoHS:否 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 标准包装:1,000 系列:- 应用:驱动器 输出类型:差分 电路数:3 -3db带宽:350MHz 转换速率:1000 V/µs 电流 - 电源:14.5mA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):5 V ~ 12 V，±2.5 V ~ 6 V 安装类型:表面贴装 封装/外壳:20-VFQFN 裸露焊盘 供应商设备封装:20-QFN 裸露焊盘（4x4） 包装:带卷 (TR) |
| LT6552CDD#TRPBF | 功能描述:IC AMP VIDEO DIFF 3.3V 8-DFN RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 标准包装:1,000 系列:- 应用:驱动器 输出类型:差分 电路数:3 -3db带宽:350MHz 转换速率:1000 V/µs 电流 - 电源:14.5mA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):5 V ~ 12 V，±2.5 V ~ 6 V 安装类型:表面贴装 封装/外壳:20-VFQFN 裸露焊盘 供应商设备封装:20-QFN 裸露焊盘（4x4） 包装:带卷 (TR) |
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