参数资料
型号: LT6600CS8-10#TR
厂商: Linear Technology
文件页数: 5/16页
文件大小: 0K
描述: IC AMP DIFF FILTER 2.5MHZ 8SOIC
标准包装: 2,500
放大器类型: 差分
电路数: 1
输出类型: 差分
电流 - 输入偏压: 40µA
电压 - 输入偏移: 8000µV
电流 - 电源: 36mA
电压 - 电源,单路/双路(±): 3 V ~ 11 V,±1.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
LT6600-10
13
66001fe
PACKAGE DESCRIPTION
DF Package
12-Lead Plastic DFN (4mm
× 4mm)
(Reference LTC DWG # 05-08-1733 Rev )
4.00
± 0.10
(4 SIDES)
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
1
6
12
7
BOTTOM VIEW—EXPOSED PAD
2.65
± 0.10
0.75
± 0.05
R = 0.115
TYP
0.25
± 0.05
0.50 BSC
2.50 REF
3.38
±0.10
0.200 REF
0.00 – 0.05
(DF12) DFN 0806 REV
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
±0.05
0.25
±0.05
0.50 BSC
3.10
± 0.05
4.50
± 0.05
PACKAGE OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35
× 45°
CHAMFER
2.65
± 0.05
3.38
±0.05
2.50 REF
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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