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参数资料
| 型号： | LT6600IS8-5#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 3/12页 |
| 文件大小： | 0K |
| 描述： | IC AMP DIFF LP FLTR 5MHZ 8-SOIC |
| 标准包装： | 2,500 |
| 放大器类型： | 差分 |
| 电路数： | 1 |
| 输出类型： | 差分 |
| 电流 - 输入偏压： | 30µA |
| 电压 - 输入偏移： | 8000µV |
| 电流 - 电源： | 30mA |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 11 V，±1.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
LT6600-5
11
66005fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
APPLICATIONS INFORMATION
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
Junction temperature, TJ, is calculated from the ambient
temperature, TA, and power dissipation, PD. The power
dissipation is the product of supply voltage, VS, and
supply current, IS. Therefore, the junction temperature
is given by:
TJ = TA + (PD θJA) = TA + (VS IS θJA)
where the supply current, IS, is a function of signal level,
load impedance, temperature and common mode volt-
ages.
For a given supply voltage, the worst-case power dis-
sipation occurs when the differential input signal is
maximum, the common mode currents are maximum
(see Applications Information regarding common mode
DC currents), the load impedance is small and the ambi-
ent temperature is maximum. To compute the junction
temperature, measure the supply current under these
worst-case conditions, estimate the thermal resistance
from Table 2, then apply the equation for TJ. For example,
using the circuit in Figure 3 with DC differential input volt-
age of 250mV, a differential output voltage of 1V, 1kΩ load
resistance and an ambient temperature of 85°C, the supply
current (current into Pin 3) measures 32.2mA. Assuming
a PC board layout with a 35mm2 copper trace, the
θJA is
100°C/W. The resulting junction temperature is:
TJ = TA + (PD θJA) = 85 + (5 0.0322 100) = 101°C
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep TJ
below 150°C.
PACKAGE DESCRIPTION
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0
°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±.005
.050 BSC
.030
±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
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