参数资料
| 型号： | LTC1049CN8 |
| 厂商： | Linear Technology |
| 文件页数： | 9/12页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP CHOP-STBL W/CAPS 8-DIP |
| 标准包装： | 50 |
| 放大器类型： | 断路器（零漂移） |
| 电路数： | 1 |
| 转换速率： | 0.8 V/µs |
| 增益带宽积： | 800kHz |
| 电流 - 输入偏压： | 15pA |
| 电压 - 输入偏移： | 2µV |
| 电流 - 电源： | 200µA |
| 电压 - 电源，单路/双路(±)： | 4.75 V ~ 16 V，±2.38 V ~ 8 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
LTC1049
6
1049fb
applicaTions inFormaTion
ACHIEVING PICOAMPERE/MICROVOLT PERFORMANCE
Picoamperes
In order to realize the picoampere level of accuracy of
the LTC1049, proper care must be exercised. Leakage
currents in circuitry external to the amplifier can signifi-
cantlydegradeperformance.Highqualityinsulationshould
be used (e.g., Teflon, Kel-F); cleaning of all insulating
surfaces to remove fluxes and other residues will probably
be necessary—particularly for high temperature perfor-
mance. Surface coating may be necessary to provide a
moisture barrier in high humidity environments.
Board leakage can be minimized by encircling the input
connections with a guard ring operated at a potential close
to that of the inputs: in inverting configurations, the guard
ringshouldbetiedtoground;innoninvertingconnections,
to the inverting input. Guarding both sides of the printed
circuit board is required. Bulk leakage reduction depends
on the guard ring width.
Microvolts
ThermocoupleeffectsmustbeconsiderediftheLTC1049’s
ultralow drift is to be fully utilized. Any connection of dis-
similarmetalsformsathermoelectricjunctionproducingan
electric potential which varies with temperature (Seebeck
effect).Astemperaturesensors,thermocouplesexploitthis
phenomenon to produce useful information. In low drift
amplifier circuits the effect is a primary source of error.
Connectors, switches, relay contacts, sockets, resistors,
solder, and even copper wire are all candidates for thermal
EMF generation. Junctions of copper wire from different
manufacturerscangeneratethermalEMFsof200nV/°C—
twice the maximum drift specification of the LTC1049.
The copper/kovar junction, formed when wire or printed
circuit traces contact a package lead, has a thermal EMF
of approximately 35V/°C—300 times the maximum drift
specification of the LTC1049.
Minimizing thermal EMF-induced errors is possible if
judicious attention is given to circuit board layout and
component selection. It is good practice to minimize the
number of junctions in the amplifier’s input signal path.
Avoid connectors, sockets, switches, and relays where
possible.Ininstanceswherethisisnotpossible,attemptto
balancethenumberandtypeofjunctionssothatdifferential
cancellation occurs. Doing this may involve deliberately
introducing junctions to offset unavoidable junctions.
PACKAGE-INDUCED OFFSET VOLTAGE
Package-induced thermal EMF effects are another
important source of errors. It arises at the copper/kovar
junctionsformedwhenwireorprintedcircuittracescontact
a package lead. Like all the previously mentioned thermal
EMF effects, it is outside the LTC1049’s offset nulling loop
andcannotbecancelled.Theinputoffsetvoltagespecifica-
tion of the LTC1049 is actually set by the package-induced
warm-up drift rather than by the circuit itself. The thermal
time constant ranges from 0.5 to 3 minutes, depending
on package type.
LOW SUPPLY OPERATION
The minimum supply for proper operation of the LTC1049
is typically below 4.0V (±2.0V). In single supply applica-
tions,PSRRisguaranteeddownto4.7V(±2.35V)toensure
proper operation down to the minimum TTL specified
voltage of 4.75V.
PIN COMPATIBILITY
The LTC1049 is pin compatible with the 8-pin versions of
7650, 7652 and other chopper-stabilized amplifiers. The
7650 and 7652 require the use of two external capacitors
connected to Pins 1 and 8 which are not needed for the
LTC1049.Pins1,5,and8oftheLTC1049arenotconnected
internally; thus, the LTC1049 can be a direct plug- in for
the 7650 and 7652, even if the two capacitors are left on
the circuit board.
相关PDF资料 |
PDF描述 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC1049CN8#PBF | 功能描述:IC OPAMP CHOP-STBL W/CAPS 8-DIP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 产品培训模块:Differential Circuit Design Techniques for Communication Applications 标准包装:1 系列:- 放大器类型:RF/IF 差分 电路数:1 输出类型:差分 转换速率:9800 V/µs 增益带宽积:- -3db带宽:2.9GHz 电流 - 输入偏压:3µA 电压 - 输入偏移:- 电流 - 电源:40mA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VQFN 裸露焊盘，CSP 供应商设备封装:16-LFCSP-VQ 包装:剪切带 (CT) 产品目录页面:551 (CN2011-ZH PDF) 其它名称:ADL5561ACPZ-R7CT |
| LTC1049CN8PBF | 制造商:Linear Technology 功能描述:Single low power op amp,LTC1049CN DIP8 |
| LTC1049CS8 | 功能描述:IC OPAMP CHOP-STBL W/CAPS 8SOIC RoHS:否 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:73 系列:Over-The-Top® 放大器类型:通用 电路数:4 输出类型:满摆幅 转换速率:0.07 V/µs 增益带宽积:200kHz -3db带宽:- 电流 - 输入偏压:1nA 电压 - 输入偏移:285µV 电流 - 电源:50µA 电流 - 输出 / 通道:25mA 电压 - 电源，单路/双路(±):2 V ~ 44 V，±1 V ~ 22 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-WFDFN 裸露焊盘 供应商设备封装:16-DFN-EP（5x3） 包装:管件 |
| LTC1049CS8#PBF | 功能描述:IC OPAMP CHOP-STBL W/CAPS 8SOIC RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:- 放大器类型:通用 电路数:4 输出类型:- 转换速率:0.6 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:45nA 电压 - 输入偏移:2000µV 电流 - 电源:1.4mA 电流 - 输出 / 通道:40mA 电压 - 电源，单路/双路(±):3 V ~ 32 V，±1.5 V ~ 16 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:带卷 (TR) 其它名称:LM324ADTBR2G-NDLM324ADTBR2GOSTR |
| LTC1049CS8#TR | 功能描述:IC OPAMP CHOP STABLE CAPS 8SOIC RoHS:否 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 放大器类型:电流检测 电路数:1 输出类型:- 转换速率:- 增益带宽积:125kHz -3db带宽:- 电流 - 输入偏压:- 电压 - 输入偏移:100µV 电流 - 电源:1.1µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:4-WFBGA，CSPBGA 供应商设备封装:4-UCSP（2x2） 包装:剪切带 (CT) 其它名称:MAX9634WERS+TCT |
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