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参数资料
| 型号： | LTC1050HS8#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 6/16页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP CHOP-STBL W/CAPS 8SOIC |
| 标准包装： | 100 |
| 放大器类型： | 断路器（零漂移） |
| 电路数： | 1 |
| 转换速率： | 4 V/µs |
| 增益带宽积： | 2.5MHz |
| 电流 - 输入偏压： | 10pA |
| 电压 - 输入偏移： | 0.5µV |
| 电流 - 电源： | 1mA |
| 电压 - 电源，单路/双路(±)： | 4.75 V ~ 16 V，±2.38 V ~ 8 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 管件 |
14
LTC1050
1050fb
J8 1298
0.014 – 0.026
(0.360 – 0.660)
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.125
3.175
MIN
0.100
(2.54)
BSC
0.300 BSC
(0.762 BSC)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS OPTION
(4 PLCS)
0.045 – 0.065
(1.143 – 1.651)
0.005
(0.127)
MIN
0.405
(10.287)
MAX
0.220 – 0.310
(5.588 – 7.874)
12
3
4
87
65
0.025
(0.635)
RAD TYP
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
U
PACKAGE DESCRIPTIO
0.050
(1.270)
MAX
0.010 – 0.045*
(0.254 – 1.143)
SEATING
PLANE
0.040
(1.016)
MAX
0.165 – 0.185
(4.191 – 4.699)
GAUGE
PLANE
REFERENCE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.305 – 0.335
(7.747 – 8.509)
0.335 – 0.370
(8.509 – 9.398)
DIA
H8(TO-5) 0.200 PCD 1197
LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
0.016 – 0.024
(0.406 – 0.610)
*
**
0.016 – 0.021**
(0.406 – 0.533)
0.200
(5.080)
TYP
0.027 – 0.045
(0.686 – 1.143)
0.028 – 0.034
(0.711 – 0.864)
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
45°TYP
PIN 1
OBSOLETE PACKAGES
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
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