参数资料
型号: LTC1290BIN
厂商: Linear Technology
文件页数: 25/32页
文件大小: 0K
描述: IC DATA ACQ SYS 12BIT 20-DIP
标准包装: 18
类型: 数据采集系统(DAS),ADC
分辨率(位): 12 b
采样率(每秒): 50k
数据接口: 串行,并联
电压电源: 双 ±
电源电压: ±5 V,5 V
工作温度: -40°C ~ 85°C
安装类型: 通孔
封装/外壳: 20-DIP(0.300",7.62mm)
供应商设备封装: 20-PDIP
包装: 管件
31
LTC1290
1290fe
SW Package
20-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
PACKAGE DESCRIPTIO
U
S20 (WIDE) 0502
NOTE 3
.496 – .512
(12.598 – 13.005)
NOTE 4
20
N
19
18
17
16
15
14
13
1
23
4
5
6
78
.394 – .419
(10.007 – 10.643)
910
N/2
11
12
.037 – .045
(0.940 – 1.143)
.004 – .012
(0.102 – 0.305)
.093 – .104
(2.362 – 2.642)
.050
(1.270)
BSC
.014 – .019
(0.356 – 0.482)
TYP
0
° – 8° TYP
NOTE 3
.009 – .013
(0.229 – 0.330)
.016 – .050
(0.406 – 1.270)
.291 – .299
(7.391 – 7.595)
NOTE 4
× 45°
.010 – .029
(0.254 – 0.737)
.420
MIN
.325
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±.005
N
12
3
N/2
.050 BSC
.030
±.005
TYP
.005
(0.127)
RAD MIN
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of circuits as described herein will not infringe on existing patent rights.
相关PDF资料
PDF描述
VE-21Y-MX-S CONVERTER MOD DC/DC 3.3V 49.5W
LTC6990CS6#TRMPBF IC OSC SILICON 1MHZ TSOT23-6
AD7891BP-1REEL IC DAS 12BIT 8CH 44-PLCC
VE-21Y-MW-S CONVERTER MOD DC/DC 3.3V 66W
MS3102A40-1P CONN RCPT 30POS BOX MNT W/PINS
相关代理商/技术参数
参数描述
LTC1290BIN#PBF 功能描述:IC DATA ACQ SYS 12BIT 20-DIP RoHS:是 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘
LTC1290BISW 功能描述:IC DATA ACQ SYS 12BIT 20-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘
LTC1290BISW#PBF 功能描述:IC DATA ACQ SYS 12BIT 20-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘
LTC1290BISW#TR 功能描述:IC DATA ACQ SYS 12BIT 5V 20SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘
LTC1290BISW#TRPBF 功能描述:IC DATA ACQ SYS 12BIT 20-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘