参数资料
型号: LTC1474IS8-5#TR
厂商: LINEAR TECHNOLOGY CORP
元件分类: 稳压器
英文描述: 0.75 A SWITCHING REGULATOR, PDSO8
封装: 0.150 INCH, PLASTIC, SO-8
文件页数: 4/20页
文件大小: 237K
代理商: LTC1474IS8-5#TR
12
LTC1474/LTC1475
APPLICATIONS INFORMATION
WU
U
Figure 8. Preventing Absolute Maximum
Ratings from Being Exceeded
1474/75 F08
VIN
VOUT
LATCHUP
PROTECTION
SCHOTTKY
SW
LTC1474
LTC1475
+
with a built-in internal disconnect. The user needs to
assess his/her application to determine whether this situ-
ation could occur. If so, additional protection is necessary.
Prevention against latchup can be accomplished by sim-
ply connecting a Schottky diode across the SW and VIN
pins as shown in Figure 8. The diode will normally be
reverse biased unless VIN is pulled below VOUT at which
time the diode will clamp the (VOUT – VIN) potential to less
than the 0.6V required for latchup. Note that a low leakage
Schottky should be used to minimize the effect on no-load
supply current. Schottky diodes such as MBR0530, BAS85
and BAT84 work well. Another more serious effect of the
protection diode leakage is that at no load with nothing to
provide a sink for this leakage current, the output voltage
can potentially float above the maximum allowable toler-
ance. To prevent this from occuring, a resistor must be
connected between VOUT and ground with a value low
enough to sink the maximum possible leakage current.
Thermal Considerations
In the majority of the applications, the LTC1474/LTC1475
do not dissipate much heat due to their high efficiency.
However, in applications where the switching regulator is
running at high ambient temperature with low supply
voltage and high duty cycles, such as dropout with the
switch on continuously, the user will need to do some
thermal analysis. The goal of the thermal analysis is to
determine whether the power dissipated by the regulator
exceeds the maximum junction temperature of the part.
The temperature rise is given by:
TR = P θJA
where P is the power dissipated by the regulator and
θJA
is the thermal resistance from the junction of the die to the
ambient temperature.
The junction temperature is given by:
TJ = TA + TR
As an example consider the LTC1474/LTC1475 in dropout
at an input voltage of 3.5V, a load current of 300mA, and
an ambient temperature of 70
°C. From the typical perfor-
mance graph of switch resistance, the on-resistance of the
P-channel switch at 70
°C is 3.5. Therefore, power dissi-
pated by the part is:
P = I2 RDS(ON) = 0.315W
For the MSOP package, the
θJA is 150°C/W. Thus the
junction temperature of the regulator is:
TJ = 70°C + (0.315)(150) = 117°C
which is near the maximum junction temperature of 125oC.
Note that at higher supply voltages, the junction tempera-
ture is lower due to reduced switch resistance.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC1474/LTC1475. These items are also illustrated
graphically in the layout diagram of Figure 9. Check the
following in your layout:
1. Is the Schottky diode cathode
closely connected to SW
(Pin 5)?
2. Is the 0.1
F input decoupling capacitor closely con-
nected between VIN (Pin 7) and ground (Pin 4)? This
capacitor carries the high frequency peak currents.
3. When using adjustable version, is the resistive divider
closely connected to the (+) and (–) plates of COUT with
a 10pF capacitor connected across R2?
4. Is the 1000pF decoupling capacitor for the current
sense resistor connected as close as possible to Pins 6
and 7? If no current sense resistor is used, Pins 6 and
7 should be shorted.
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