参数资料
型号: LTC1625IGN#PBF
厂商: Linear Technology
文件页数: 18/24页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM CM 16-SSOP
标准包装: 100
PWM 型: 电流模式
输出数: 1
频率 - 最大: 165kHz
占空比: 99%
电源电压: 3.9 V ~ 36 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 16-SSOP(0.154",3.90mm 宽)
包装: 管件
产品目录页面: 1333 (CN2011-ZH PDF)
LTC1625
APPLICATIO N S I N FOR M ATIO N
V IN
470pF R C
C B
C C1
C SS
0.1 μ F INTV CC
OPEN
10k
C C2
220pF
1
2
3
4
5
6
7
8
EXTV CC V IN
SYNC TK
RUN/SS SW
LTC1625
FCB TG
I TH BOOST
SGND INTV CC
V OSENSE BG
V PROG PGND
16
15
14
13
12
11
10
9
D B
CMDSH-3 0.1 μ F
C VCC
4.7 μ F
+
M1
Si4412DY
M2
Si4412DY
L1
15 μ H
+
C IN
22 μ F
35V
× 2
+
12V TO 22V
V OUT
3.3V
2A
C OUT
100 μ F
10V
0.065 ?
× 2
D1
MBRS140T3
1625 F09
C IN : AVX TPSE226M035R0300
C OUT : AVX TPSD107M010R0065
L1: SUMIDA CDRH125-150MC
Figure 9. 3.3V/2A Fixed Output at 225kHz
C IN is chosen for an RMS current rating of at least 1A at
temperature. C OUT is chosen with an ESR of 0.033 ? for
low output ripple. The output ripple in continuous mode
will be highest at the maximum input voltage and is
approximately:
? V O = ( ? I L(MAX) )(ESR) = (0.83A)(0.033 ? ) = 27mV
The complete circuit is shown in Figure 9.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC1625. These items are also illustrated graphically in
the layout diagram of Figure 10. Check the following in
your layout:
1) Connect the TK lead directly to the drain of the topside
MOSFET. Then connect the drain to the (+) plate of C IN .
This capacitor provides the AC current to the top
MOSFET.
2) The power ground pin connects directly to the source of
the bottom N-channel MOSFET. Then connect the source
to the anode of the Schottky diode and (–) plate of C IN ,
which should have as short lead lengths as possible.
3) The LTC1625 signal ground pin must return to the (–)
plate of C OUT . Connect the (–) plate of C OUT to power
ground at the source of the bottom MOSFET
4) Keep the switch node SW away from sensitive small-
signal nodes. Ideally the switch node should be placed
on the opposite side of the power MOSFETs from the
LTC1625.
5) Connect the INTV CC decoupling capacitor C VCC closely
to the INTV CC pin and the power ground pin. This
capacitor carries the MOSFET gate drive current.
6) Does the V OSENSE pin connect directly to the (+) plate of
C OUT ? In adjustable applications, the resistive divider
(R1, R2) must be connected between the (+) plate of
C OUT and signal ground. Place the divider near the
LTC1625 in order to keep the high impedance V OSENSE
node short.
7) For applications with multiple switching power con-
verters connected to the same V IN , ensure that the input
filter capacitance for the LTC1625 is not shared with the
other converters. AC input current from another con-
verter will cause substantial input voltage ripple that
may interfere with proper operation of the LTC1625. A
few inches of PC trace or wire ( ≈ 100nH) between C IN
and V IN is sufficient to prevent sharing.
18
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