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参数资料
| 型号： | LTC1746CFW#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 10/20页 |
| 文件大小： | 0K |
| 描述： | IC ADC 14BIT 25MSPS LP 48TSSOP |
| 标准包装： | 39 |
| 位数： | 14 |
| 采样率（每秒）： | 25M |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 465mW |
| 电压电源： | 单电源 |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-TFSOP（0.240"，6.10mm 宽） |
| 供应商设备封装： | 48-TSSOP |
| 包装： | 管件 |
| 输入数目和类型： | 2 个单端，双极；1 个差分，双极 |
18
LTC1746
1746f
APPLICATIO S I FOR ATIO
WU
UU
High quality ceramic bypass capacitors should be used at
the VDD, VCM, REFHA, REFHB, REFLA and REFLB pins as
shown in the block diagram on the front page of this data
sheet. Bypass capacitors must be located as close to the
pins as possible. Of particular importance are the capaci-
tors between REFHA and REFLB and between REFHB and
REFLA. These capacitors should be as close to the device
as possible (1.5mm or less). Size 0402 ceramic capacitors
are recomended. The large 4.7
FcapacitorbetweenREFHA
and REFLA can be somewhat further away. The traces
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC1746 differential inputs should run parallel and
close to each other. The input traces should be as short as
possible to minimize capacitance and to minimize noise
pickup.
An analog ground plane separate from the digital process-
ing system ground should be used. All ADC ground pins
labeled GND should connect to this plane. All ADC VDD
bypass capacitors, reference bypass capacitors and input
filter capacitors should connect to this analog plane. The
LTC1746 has three output driver ground pins, labeled
OGND (Pins 27, 38 and 47). These grounds should con-
nect to the digital processing system ground. The output
driver supply, OVDD should be connected to the digital
processing system supply. OVDD bypasscapacitorsshould
bypass to the digital system ground. The digital process-
ing system ground should be connected to the analog
plane at ADC OGND (Pin 38).
HEAT TRANSFER
Most of the heat generated by the LTC1746 is transferred
from the die through the package leads onto the printed
circuit board. In particular, ground pins 12, 13, 36 and 37
are fused to the die attach pad. These pins have the lowest
thermal resistance between the die and the outside envi-
ronment. It is critical that all ground pins are connected to
a ground plane of sufficient area. The layout of the evalu-
ation circuit shown on the following pages has a low ther-
mal resistance path to the internal ground plane by using
multiple vias near the ground pins. A ground plane of this
size results in a thermal resistance from the die to ambient
of 35
°C/W.Smallerareagroundplanesorpoorlyconnected
ground pins will result in higher thermal resistance.
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| LTC1746IFW | 制造商:Linear Technology 功能描述:ADC Single Pipelined 25Msps 14-bit Parallel 48-Pin TSSOP |
| LTC1746IFW#PBF | 功能描述:IC ADC 14BIT 25MSPS LP 48TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1 系列:microPOWER™ 位数:8 采样率（每秒）:1M 数据接口:串行，SPI? 转换器数目:1 功率耗散（最大）:- 电压电源:模拟和数字 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-VQFN 裸露焊盘（4x4） 包装:Digi-Reel® 输入数目和类型:8 个单端，单极 产品目录页面:892 (CN2011-ZH PDF) 其它名称:296-25851-6 |
| LTC1746IFW#TR | 制造商:Linear Technology 功能描述:ADC Single Pipelined 25Msps 14-bit Parallel 48-Pin TSSOP T/R |
| LTC1746IFW#TRPBF | 功能描述:IC ADC 14BIT 25MSPS LP 48TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:12 采样率（每秒）:300k 数据接口:并联 转换器数目:1 功率耗散（最大）:75mW 电压电源:单电源 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC 包装:带卷 (TR) 输入数目和类型:1 个单端，单极；1 个单端，双极 |
| LTC1747CFW | 功能描述:IC ADC 12BIT 80MSPS 48-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1 系列:- 位数:14 采样率（每秒）:83k 数据接口:串行，并联 转换器数目:1 功率耗散（最大）:95mW 电压电源:双 ± 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:28-DIP（0.600"，15.24mm） 供应商设备封装:28-PDIP 包装:管件 输入数目和类型:1 个单端，双极 |
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