参数资料
型号: LTC1754ES6-3.3#TRPBF
厂商: Linear Technology
文件页数: 8/12页
文件大小: 0K
描述: IC REG SWITCHED CAP 3.3V SOT23-6
标准包装: 2,500
类型: 切换式电容器(充电泵)
输出类型: 固定
输出数: 1
输出电压: 3.3V
输入电压: 2 V ~ 4.4 V
PWM 型: Burst Mode?
频率 - 开关: 600kHz
电流 - 输出: 40mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: SOT-23-6
包装: 带卷 (TR)
供应商设备封装: SOT-23-6
LTC1754-3.3/LTC1754-5
APPLICATIO S I FOR ATIO
signal will keep V OUT in regulation under no-load condi-
tions. As the V OUT load current increases, the frequency
with which the LTC1754 is taken out of shutdown must
also be increased.
Layout Considerations
Due to high switching frequency and high transient cur-
rents produced by the LTC1754, careful board layout is
necessary. A true ground plane and short connections to
all capacitors will improve performance and ensure proper
V OUT
10 μ F
SHDN PIN
WAVEFORM
1
2
3
V OUT C +
LTC1754-X
GND V IN
SHDN C –
6
5
4
1 μ F
10 μ F
V IN
regulation under all conditions. Figure 4 shows the recom-
mended layout configuration
V IN
LOW I Q MODE (2Hz TO 100Hz, 2% TO 5% DUTY CYCLE)
1754 F02
V OUT
10 μ F
10 μ F
1 μ F
Figure 2. Ultralow Quiescent Current Regulated Supply
GND
LTC1754-X
SHDN
1754-5 F04
T A = 25 ° C
6
I OUT = 0 μ A
5 C FLY = 1 μ F
Figure 4. Recommended Layout
4
3
2
1
LTC1754-5
LTC1754-3.3
Thermal Management
For higher input voltages and maximum output current,
there can be substaintial power dissipation in the LTC1754.
If the junction temperature increases above approximately
150 ° C, the thermal shutdown circuitry will automatically
deactivate the output. To reduce the maximum junction
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
temperature, a good thermal connection to the PC board
is recommended. Connecting the GND pin (Pin 2) to a
SUPPLY VOLTAGE (V)
1754 F03
ground plane and maintaining a solid ground plane under
the device on at least two layers of the PC board can reduce
8
Figure 3. No-Load Supply Current vs Supply Voltage
for the Circuit Shown in Figure 2
the thermal resistance of the package and PC board
system to about 150 ° C/W.
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