参数资料
型号: LTC1859CG#TRPBF
厂商: Linear Technology
文件页数: 11/20页
文件大小: 0K
描述: IC A/D CONV 8CH 16BIT 28-SSOP
标准包装: 2,000
系列: SoftSpan™
位数: 16
采样率(每秒): 100k
数据接口: MICROWIRE?,串行,SPI?
转换器数目: 1
功率耗散(最大): 40mW
电压电源: 模拟和数字
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 28-SSOP(0.209",5.30mm 宽)
供应商设备封装: 28-SSOP
包装: 带卷 (TR)
输入数目和类型: 8 个单端,单极;8 个单端,双极;4 个差分,单极;4 个差分,双极
配用: DC682A-ND - BOARD SAR ADC LTC1859
LTC1857/LTC1858/LTC1859
19
185789fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
APPLICATIONS INFORMATION
1859 F13
ADC+
LTC1857/LTC1858/LTC1859
DIGITAL
SYSTEM
OVDD
DGND
24
21
ADC
10μF
DVDD
20
10μF
AVDD
19
AGND
14, 17, 18
10μF
REFCOMP
16
10μF
VREF
15
12
MUXOUT+
LTC1857/
LTC1858/
LTC1859
MUXOUT
10
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
11
13
1μF
ANALOG GROUND PLANE
+
Figure 13. Power Supply Grounding Practice
LTC1858/LTC1859 can be tied to the analog ground plane.
Placing the bypass capacitor as close as possible to the
power supply pins, the reference and reference buffer out-
put is very important. Low impedance common returns for
these bypass capacitors are essential to low noise operation
of the ADC, and the foil width for these tracks should be
as wide as possible. Also, since any potential difference in
grounds between the signal source and ADC appears as
an error voltage in series with the input signal, attention
should be paid to reducing the ground circuit impedance
as much as possible. The digital output latches and the
onboard sampling clock have been placed on the digital
ground plane. The two ground planes are tied together at
the power supply ground connection.
G Package
28-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1640)
0.09 – 0.25
(.0035 – .010)
0
° – 8°
0.55 – 0.95
(.022 – .037)
5.00 – 5.60**
(.197 – .221)
G28 SSOP 0204
7.40 – 8.20
(.291 – .323)
12 3
4
5
6 7 8
9 10 11 12
14
13
9.90 – 10.50*
(.390 – .413)
25
26
22 21 20 19 18 17 16 15
23
24
27
28
2.0
(.079)
MAX
0.05
(.002)
MIN
0.65
(.0256)
BSC
0.22 – 0.38
(.009 – .015)
TYP
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
*
**
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
0.42
±0.03
0.65 BSC
5.3 – 5.7
7.8 – 8.2
RECOMMENDED SOLDER PAD LAYOUT
1.25
±0.12
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