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| 型号： | LTC1911EMS8-1.8 |
| 厂商： | Linear Technology |
| 文件页数： | 10/12页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK 1.8V 0.25A 8MSOP |
| 标准包装： | 50 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 1.8V |
| 输入电压： | 2.7 V ~ 5.5 V |
| PWM 型： | Burst Mode? |
| 频率 - 开关： | 1.5MHz |
| 电流 - 输出： | 250mA |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 包装： | 管件 |
| 供应商设备封装： | 8-MSOP |
| 其它名称： | LTC1911EMS81.8 |
LTC1911-1.5/LTC1911-1.8
APPLICATIO S I FOR ATIO
is needed to ensure that minimum capacitance values are
met over operating temperature and bias voltage.
Table 1 is a list of ceramic capacitor manufacturers and
how to contact them.
Table 1. Ceramic Capacitor Manufacturers
AVX 1-(803)-448-1943 www.avxcorp.com
Additional output filtering can be achieved by placing a
second output capacitor, connected to the ground plane,
about 2cm or more from the LTC1911 output capacitor
(C4). The inductance of the trace running to the second
output capacitor will significantly attenuate the high speed
switching transients of the LTC1911. Even small capaci-
tors as low as 0.1 μ F will provide excellent results.
Kemet
1-(864) 963-6300
www.kemet.com
Murata
Taiyo Yuden
Vishay
1-(800) 831-9172
1-(800) 348-2496
1-(800) 487-9437
www.murata.com
www.t-yuden.com
www.vishay.com
Thermal Management
The power dissipation in the LTC1911 can cause the
junction temperature to rise at rates of up to 160 ° C/W. If
Layout Considerations
Due to the high switching frequency and transient cur-
rents produced by the LTC1911, careful board layout is
necessary for optimal performance. A true ground plane
and short connections to all capacitors will optimize
performance, reduce noise and ensure proper regulation
over all conditions. Figure 3 shows the recommended
layout configuration.
the specified operating conditions are followed, the junc-
tion temperature should never exceed the 160 ° C thermal
shutdown temperature. The junction temperature can
come very close and possibly exceed the specified 125 ° C
operating junction temperature. To reduce the maximum
junction temperature, a good thermal connection to the PC
board is recommended. Connecting the GND pin (Pin 4) to
a ground plane, and maintaining a solid ground plane
under the device on two layers of the PC board, can reduce
the thermal resistance of the package and PC board
considerably.
C3
V IN
SS/SHDN
U1
C2
GND
C4
OUT
C1
1911 F03
: CONNECT TO GND PLANE ON BACK OF BOARD
Figure 3. Recommended Component Placement and Grounding
1911f
10
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