参数资料
型号: LTC2053IMS8#TRPBF
厂商: Linear Technology
文件页数: 7/18页
文件大小: 0K
描述: IC AMP INST 0-DRFT R-R I/O 8MSOP
标准包装: 2,500
放大器类型: 断路器(零漂移)
电路数: 1
输出类型: 满摆幅
转换速率: 0.2 V/µs
增益带宽积: 200kHz
电流 - 输入偏压: 4nA
电压 - 输入偏移: 5µV
电流 - 电源: 950µA
电压 - 电源,单路/双路(±): 2.7 V ~ 11 V,±1.35 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 带卷 (TR)
LTC2053/LTC2053-SYNC
2053syncfc
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 0.10
(2 SIDES)
0.75 0.05
R = 0.125
TYP
2.38 0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25 0.05
2.38 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 0.05
(2 SIDES)
2.10 0.05
0.50
BSC
0.70 0.05
3.5 0.05
PACKAGE
OUTLINE
0.25 0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
package DescripTion
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