参数资料
型号: LTC2225IUH#TRPBF
厂商: Linear Technology
文件页数: 7/20页
文件大小: 0K
描述: IC ADC 12BIT 10MSPS 3V 32-QFN
标准包装: 2,500
位数: 12
采样率(每秒): 10M
数据接口: 并联
转换器数目: 1
功率耗散(最大): 69mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-WFQFN 裸露焊盘
供应商设备封装: 32-QFN 裸露焊盘(5x5)
包装: 带卷 (TR)
输入数目和类型: 1 个单端,双极; 1 个差分,双极
LTC2225
15
2225fa
APPLICATIO S I FOR ATIO
WU
UU
and nap modes, all digital outputs are disabled and enter
the Hi-Z state.
Grounding and Bypassing
The LTC2225 requires a printed circuit board with a clean,
unbroken ground plane. A multilayer board with an inter-
nal ground plane is recommended. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, REFH, and REFL pins. Bypass capaci-
tors must be located as close to the pins as possible. Of
particular importance is the 0.1
F capacitor between
REFH and REFL. This capacitor should be placed as close
to the device as possible (1.5mm or less). A size 0402
ceramic capacitor is recommended. The large 2.2
F
capacitor between REFH and REFL can be somewhat
further away. The traces connecting the pins and bypass
capacitors must be kept short and should be made as wide
as possible.
The LTC2225 differential inputs should run parallel and
close to each other. The input traces should be as short as
possible to minimize capacitance and to minimize noise
pickup.
Heat Transfer
Most of the heat generated by the LTC2225 is transferred
from the die through the bottom-side exposed pad and
package leads onto the printed circuit board. For good
electrical and thermal performance, the exposed pad
should be soldered to a large grounded pad on the PC
board. It is critical that all ground pins are connected to a
ground plane of sufficient area.
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