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参数资料
| 型号： | LTC2253CUH#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 11/24页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT 125MSPS 3V 32-QFN |
| 标准包装： | 2,500 |
| 位数： | 12 |
| 采样率（每秒）： | 125M |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 468mW |
| 电压电源： | 单电源 |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-WFQFN 裸露焊盘 |
| 供应商设备封装： | 32-QFN 裸露焊盘（5x5） |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 1 个单端，双极; 1 个差分，双极 |
LTC2253/LTC2252
19
22532fa
APPLICATIO S I FOR ATIO
WU
U
particular importance is the 0.1
FcapacitorbetweenREFH
and REFL. This capacitor should be placed as close to the
device as possible (1.5mm or less). A size 0402 ceramic
capacitor is recommended. The large 2.2
F capacitor
between REFH and REFL can be somewhat further away.
The traces connecting the pins and bypass capacitors
must be kept short and should be made as wide as
possible.
The LTC2253/LTC2252 differential inputs should run par-
allel and close to each other. The input traces should be as
short as possible to minimize capacitance and to minimize
noise pickup.
Heat Transfer
Most of the heat generated by the LTC2253/LTC2252 is
transferred from the die through the bottom-side exposed
pad and package leads onto the printed circuit board. For
good electrical and thermal performance, the exposed pad
should be soldered to a large grounded pad on the PC
board. It is critical that all ground pins are connected to a
ground plane of sufficient area.
Clock Sources for Undersampling
Undersampling raises the bar on the clock source and the
higher the input frequency, the greater the sensitivity to
clock jitter or phase noise. A clock source that degrades
SNR of a full-scale signal by 1dB at 70MHz will degrade
SNR by 3dB at 140MHz, and 4.5dB at 190MHz.
In cases where absolute clock frequency accuracy is
relatively unimportant and only a single ADC is required,
a 3V canned oscillator from vendors such as Saronix or
Vectron can be placed close to the ADC and simply
connected directly to the ADC. If there is any distance to
the ADC, some source termination to reduce ringing that
may occur even over a fraction of an inch is advisable. You
must not allow the clock to overshoot the supplies or
performance will suffer. Do not filter the clock signal with
a narrow band filter unless you have a sinusoidal clock
source, as the rise and fall time artifacts present in typical
digital clock signals will be translated into phase noise.
The lowest phase noise oscillators have single-ended
sinusoidal outputs, and for these devices the use of a filter
close to the ADC may be beneficial. This filter should be
close to the ADC to both reduce roundtrip reflection times,
as well as reduce the susceptibility of the traces between
the filter and the ADC. If you are sensitive to close-in phase
noise, the power supply for oscillators and any buffers
must be very stable, or propagation delay variation with
supply will translate into phase noise. Even though these
clock sources may be regarded as digital devices, do not
operate them on a digital supply. If your clock is also used
to drive digital devices such as an FPGA, you should locate
the oscillator, and any clock fan-out devices close to the
ADC, and give the routing to the ADC precedence. The
clock signals to the FPGA should have series termination
at the source to prevent high frequency noise from the
FPGA disturbing the substrate of the clock fan-out device.
If you use an FPGA as a programmable divider, you must
re-time the signal using the original oscillator, and the re-
timing flip-flop as well as the oscillator should be close to
the ADC, and powered with a very quiet supply.
For cases where there are multiple ADCs, or where the
clock source originates some distance away, differential
clock distribution is advisable. This is advisable both from
the perspective of EMI, but also to avoid receiving noise
from digital sources both radiated, as well as propagated
in the waveguides that exist between the layers of multi-
layer PCBs. The differential pairs must be close together,
and distanced from other signals. The differential pair
should be guarded on both sides with copper distanced at
least 3x the distance between the traces, and grounded
with vias no more than 1/4 inch apart.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC2253IUH | 制造商:Linear Technology 功能描述:ADC Single Pipelined 125Msps 12-bit Parallel 32-Pin QFN EP |
| LTC2253IUH#PBF | 功能描述:IC ADC 12-BIT 125MSPS 3V 32-QFN RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1 系列:microPOWER™ 位数:8 采样率（每秒）:1M 数据接口:串行，SPI? 转换器数目:1 功率耗散（最大）:- 电压电源:模拟和数字 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-VQFN 裸露焊盘（4x4） 包装:Digi-Reel® 输入数目和类型:8 个单端，单极 产品目录页面:892 (CN2011-ZH PDF) 其它名称:296-25851-6 |
| LTC2253IUH#TRPBF | 功能描述:IC ADC 12BIT 125MSPS 3V 32-QFN RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1 系列:- 位数:14 采样率（每秒）:83k 数据接口:串行，并联 转换器数目:1 功率耗散（最大）:95mW 电压电源:双 ± 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:28-DIP（0.600"，15.24mm） 供应商设备封装:28-PDIP 包装:管件 输入数目和类型:1 个单端，双极 |
| LTC2254 | 制造商:LINER 制造商全称:Linear Technology 功能描述:14-Bit, 125/105Msps Low Power 3V ADCs |
| LTC2254CUH | 制造商:Linear Technology 功能描述:ADC Single Pipelined 105Msps 14-bit Parallel 32-Pin QFN EP |
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