参数资料
型号: LTC2292CUP#PBF
厂商: Linear Technology
文件页数: 20/28页
文件大小: 0K
描述: IC ADC DUAL 12BIT 40MSPS 64QFN
标准包装: 40
位数: 12
采样率(每秒): 40M
数据接口: 并联
转换器数目: 2
功率耗散(最大): 285mW
电压电源: 单电源
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 64-WFQFN 裸露焊盘
供应商设备封装: 64-QFN(9x9)
包装: 管件
输入数目和类型: 2 个单端,双极; 2 个差分, 双极
产品目录页面: 1349 (CN2011-ZH PDF)
LTC2293/LTC2292/LTC2291
27
229321fa
PACKAGE DESCRIPTIO
U
UP Package
64-Lead Plastic QFN (9mm
× 9mm)
(Reference LTC DWG # 05-08-1705)
9 .00
± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
PIN 1 TOP MARK
(SEE NOTE 5)
0.40
± 0.10
64
63
1
2
BOTTOM VIEW—EXPOSED PAD
7.15
± 0.10
(4-SIDES)
0.75
± 0.05
R = 0.115
TYP
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UP64) QFN 1003
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70
±0.05
7.15
±0.05
(4 SIDES)
8.10
±0.05 9.50 ±0.05
0.25
±0.05
0.50 BSC
PACKAGE OUTLINE
PIN 1
CHAMFER
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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