参数资料
型号: LTC2850IMS8#PBF
厂商: Linear Technology
文件页数: 7/18页
文件大小: 0K
描述: IC TXRX RS485/RS422 8MSOP
标准包装: 50
类型: 收发器
驱动器/接收器数: 1/1
规程: RS422,RS485
电源电压: 3 V ~ 3.6 V
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 管件
产品目录页面: 1354 (CN2011-ZH PDF)
LTC2850/LTC2851/LTC2852
285012fd
package DescripTion
MS8 Package
8Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MS Package
10Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev E)
MSOP (MS8) 0307 REV F
0.53 0.152
(.021 .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016 0.0508
(.004 .002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
1 2 3 4
4.90 0.152
(.193 .006)
8 7 6 5
3.00 0.102
(.118 .004)
(NOTE 3)
3.00 0.102
(.118 .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 0.127
(.035 .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 0.038
(.0165 .0015)
TYP
0.65
(.0256)
BSC
MSOP (MS) 0307 REV E
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8
9
10
7 6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
0.1016 ± 0.0508
(.004 ± .002)
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