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参数资料
| 型号： | LTC3204BEDC-5#TR |
| 厂商： | Linear Technology |
| 文件页数： | 11/12页 |
| 文件大小： | 0K |
| 描述： | IC REG SWITCHED CAP DBL 5V 6DFN |
| 标准包装： | 2,500 |
| 类型： | 切换式电容器（充电泵），倍增器 |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 5V |
| 输入电压： | 2.7 V ~ 5.5 V |
| PWM 型： | Burst Mode? |
| 频率 - 开关： | 1.2MHz |
| 电流 - 输出： | 150mA |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 6-DFN-EP（2x2） |
LTC3204-3.3/LTC3204-5/
LTC3204B-3.3/LTC3204B-5
APPLICATIO S I FOR ATIO
THIS CAN BE ACHIEVED FROM A PRINTED CIRCUIT BOARD LAYOUT
WITH A SOLID GROUND PLANE AND A GOOD CONNECTION TO THE
GROUND PINS OF LTC3204-3.3/LTC3204-5/LTC3204B-3.3/
LTC3204B-5 AND THE EXPOSED PAD OF THE DFN PACKAGE.
3.0
2.5
2.0
1.5
1.0
0.5
OPERATION OUT OF THIS CURVE WILL CAUSE THE JUNCTION TEM-
PERATURE TO EXCEED 160°C WHICH MAY TRIGGER THE THERMAL
SHUTDOWN.
0
–50 –25
0
25
50
75
100 125 150
AMBIENT TEMPERATURE (C)
3204 G05
FIGURE 5. MAXIMUM POWER DISSIPATION
VS AMBIENT TEMPERATURE
PACKAGE DESCRIPTIO
DC PACKAGE
6-LEAD PLASTIC DFN (2MM × 2MM)
(REFERENCE LTC DWG # 05-08-1703)
0.675 ± 0.05
R = 0.115
TYP
0.56 ± 0.05
(2 SIDES)
4
6
0.38 ± 0.05
1.15 ± 0.05 0.61 ± 0.05
3
1
2.50 ± 0.05
(2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
1.42 ± 0.05
(2 SIDES)
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
2.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
PIN 1
CHAMFER OF
EXPOSED PAD
(DC6) DFN 1103
0.25 ± 0.05
0.50 BSC
1.37 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15MM ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3204fa
INFORMATION FURNISHED BY LINEAR TECHNOLOGY CORPORATION IS BELIEVED TO BE ACCURATE AND RELIABLE. HOWEVER,
NO RESPONSIBILITY IS ASSUMED FOR ITS USE. LINEAR TECHNOLOGY CORPORATION MAKES NO REPRESENTATION THAT
THE INTERCONNECTION OF ITS CIRCUITS AS DESCRIBED HEREIN WILL NOT INFRINGE ON EXISTING PATENT RIGHTS.
11
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