参数资料
型号: LTC3419EMS-1#TRPBF
厂商: Linear Technology
文件页数: 15/16页
文件大小: 0K
描述: IC REG BUCK SYNC 0.6A DL 10MSOP
标准包装: 2,500
类型: 降压(降压)
输出类型: 固定
输出数: 2
输出电压: 1.58V,1.8V
输入电压: 2.5 V ~ 5.5 V
PWM 型: 电流模式,混合
频率 - 开关: 2.25MHz
电流 - 输出: 600mA
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
包装: 带卷 (TR)
供应商设备封装: 10-MSOP
LTC3419
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
R = 0.115
TYP
5
8
0.38 ± 0.10
3.5 ±0.05
1.65 ±0.05
3.00 ±0.10
1.65 ± 0.10
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
(4 SIDES)
(2 SIDES)
TOP MARK
(NOTE 6)
4
1
(DD) DFN 1203
0.25 ± 0.05
0.50
0.200 REF
0.75 ±0.05
0.25 ± 0.05
0.50 BSC
BSC
2.38 ±0.10
NOTE:
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889 ± 0.127
3.00 ± 0.102
(.035 ± .005)
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
0.497 ± 0.076
(.0196 ± .003)
REF
5.23
(.206)
MIN
0.305 ± 0.038
(.0120 ± .0015)
3.20 – 3.45
(.126 – .136)
0.50
(.0197)
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
TYP
BSC
RECOMMENDED SOLDER PAD LAYOUT
1.10
1 2 3 4 5
0.86
0.254
(.010)
DETAIL “A”
0° – 6° TYP
0.18
(.007)
DETAIL “A”
(.043)
MAX
(.034)
REF
GAUGE PLANE
SEATING
0.53 ± 0.152
(.021 ± .006)
PLANE
0.17 –?0.27
(.007 – .011)
TYP
0.50
(.0197)
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MS) 0307 REV E
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
BSC
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE
0.102mm (.004") MAX
3419fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation
that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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