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| 型号： | LTC3419IMS-1#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 12/16页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 0.6A 10MSOP |
| 标准包装： | 2,500 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 2 |
| 输出电压： | 0.6 V ~ 5.5 V |
| 输入电压： | 2.5 V ~ 5.5 V |
| PWM 型： | 电流模式，混合 |
| 频率 - 开关： | 2.25MHz |
| 电流 - 输出： | 600mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 10-MSOP |
LTC3419
APPLICATIONS INFORMATION
The R DS(ON) for both the top and bottom MOSFETs can be
obtained from the Typical Performance Characteristics
curves. Thus, to obtain I 2 R losses:
I 2 R losses = I OUT2 ? (R SW + R L )
4. Other “hidden” losses, such as copper trace and
internal battery resistances, can account for additional
ef?ciency degradations in portable systems. It is very
important to include these “system” level losses in
the design of a system. The internal battery and fuse
resistance losses can be minimized by making sure that
C IN has adequate charge storage and very low ESR at
the switching frequency. Other losses, including diode
conduction losses during dead-time, and inductor
core losses, generally account for less than 2% total
additional loss.
Thermal Considerations
In a majority of applications, the LTC3419 does not
dissipate much heat due to its high ef?ciency. In the
unlikely event that the junction temperature somehow
reaches approximately 150°C, both power switches will be
turned off and the SW node will become high impedance.
The goal of the following thermal analysis is to determine
whether the power dissipated causes enough temperature
rise to exceed the maximum junction temperature (125°C)
of the part. The temperature rise is given by:
T RISE = P D ? θ JA
Where P D is the power dissipated by the regulator and
θ JA is the thermal resistance from the junction of the die
to the ambient temperature. The junction temperature,
T J , is given by:
T J = T RISE + T AMBIENT
As a worst-case example, consider the case when the
LTC3419 is in dropout on both channels at an input voltage
of 2.7V with a load current of 600mA and an ambient
temperature of 70°C. From the Typical Performance
Characteristics graph of Switch Resistance, the R DS(ON)
of the main switch is 0.6 Ω . Therefore, power dissipated
by each channel is:
P D = I OUT2 ? R DS(ON) = 216mV
Given that the thermal resistance of a properly soldered
DFN package is approximately 40°C/W, the junction
temperature of an LTC3419 device operating in a 70°C
ambient temperature is approximately:
T J = (2 ? 0.216W ? 40°C/W) + 70°C = 87.3°C
which is well below the absolute maximum junction
temperature of 125°C.
PC Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3419. These items are also illustrated graphically in the
layout diagrams of Figures 2 and 3. Check the following
in your layout:
1. Does the capacitor C IN connect to the power V IN (Pin 5)
and GND (Pin 9) as closely as possible? This capacitor
provides the AC current of the internal power MOSFETs
and their drivers.
2. Are the respective C OUT and L closely connected? The
(–) plate of C OUT returns current to GND and the (–)
plate of C IN .
3. The resistor divider, R1 and R2, must be connected
between the (+) plate of C OUT1 and a ground sense line
terminated near GND (Pin 9). The feedback signals V FB1
and V FB2 should be routed away from noisy components
and traces, such as the SW lines (Pins 4 and 6), and
their trace length should be minimized.
4. Keep sensitive components away from the SW pins, if
possible. The input capacitor C IN and the resistors R1,
R2, R3 and R4 should be routed away from the SW
traces and the inductors.
5. A ground plane is preferred, but if not available, keep
the signal and power grounds segregated with small
signal components returning to the GND pin at a single
point. These ground traces should not share the high
current path of C IN or C OUT .
6. Flood all unused areas on all layers with copper.
Flooding with copper will reduce the temperature rise
of power components. These copper areas should be
connected to V IN or GND.
3419fa
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