参数资料
型号: LTC3441EDE#TRPBF
厂商: Linear Technology
文件页数: 15/16页
文件大小: 0K
描述: IC REG BUCK BOOST SYNC ADJ 12DFN
标准包装: 2,500
类型: 降压(降压),升压(升压)
输出类型: 可调式
输出数: 1
输出电压: 2.4 V ~ 5.25 V
输入电压: 2.4 V ~ 5.5 V
PWM 型: Burst Mode?
频率 - 开关: 1MHz
电流 - 输出: 1.2A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 12-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 12-DFN(4x3)
LTC3441
PACKAGE DESCRIPTIO
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
0.70 ± 0.05
3.60 ± 0.05
2.20 ± 0.05
3.30 ± 0.05
1.70 ± 0.05
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ± 0.10
R = 0.115
0.40 ± 0.10
(2 SIDES)
7
TYP
12
R = 0.05
TYP
PIN 1
TOP MARK
(NOTE 6)
3.00 ± 0.10
(2 SIDES)
3.30 ± 0.10
1.70 ± 0.10
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45 °
CHAMFER
0.200 REF
0.75 ± 0.05
6
0.25 ± 0.05
1
0.50 BSC
(UE12/DE12) DFN 0806 REV D
2.50 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3441fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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LTC3442EDE#TR 制造商:Linear Technology 功能描述:Conv DC-DC Single Non-Inv/Inv/Step Up/Step Down 2.4V to 5.5V 12-Pin DFN EP T/R
LTC3442EDE#TRPBF 功能描述:IC REG BUCK BOOST SYNC ADJ 12DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:2,500 系列:- 类型:降压(降压) 输出类型:固定 输出数:1 输出电压:1.2V,1.5V,1.8V,2.5V 输入电压:2.7 V ~ 20 V PWM 型:- 频率 - 开关:- 电流 - 输出:50mA 同步整流器:是 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:10-TFSOP,10-MSOP(0.118",3.00mm 宽)裸露焊盘 包装:带卷 (TR) 供应商设备封装:10-MSOP 裸露焊盘