参数资料
型号: LTC3444EDD#TRPBF
厂商: Linear Technology
文件页数: 19/20页
文件大小: 0K
描述: IC DC/DC CONV WCDMA 8-DFN
标准包装: 2,500
应用: 转换器,WCDMA 功率放大器应用
输入电压: 2.75 V ~ 5.5 V
输出数: 1
输出电压: 0.5 V ~ 5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-WFDFN 裸露焊盘
供应商设备封装: 8-DFN-EP(3x3)
包装: 带卷 (TR)
LTC3444
TYPICAL APPLICATIO S
Single Li-Ion, 3.1V to 4.2V Input, 3.3V at 400mA
Output with Internal Compensation
2.2 μ H
L1
LTC3444
R1
V OUT
3.3V AT 400mA
SW1
SW2
340k
3.1V TO 4.4V
V IN
V OUT
C OUT
4.7 μ F
Li-Ion
+
C IN
4.7 μ F
SHDN
GND
FB
V C
R2
200k
3444 TA04
C IN = MURATA:GRM31CR61C475K
C OUT = MURATA:GRM31CR61C475K
L1 = COOPER BUSSMAN SD12-2R2
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ± 0.05
R = 0.115
TYP
5
8
0.38 ± 0.10
3.5 ± 0.05 1.65 ± 0.05
2.15 ± 0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(NOTE 6)
3.00 ± 0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
(DD) DFN 1203
0.25 ± 0.05
0.50
0.200 REF
0.75 ± 0.05
4
0.25 ± 0.05
1
0.50 BSC
BSC
2.38 ± 0.10
NOTE:
2.38 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3444fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
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