参数资料
型号: LTC3454EDD#PBF
厂商: Linear Technology
文件页数: 11/12页
文件大小: 0K
描述: IC LED DRIVER PHOTO FLASH 10-DFN
标准包装: 121
拓扑: PWM,降压(降压),升压(升压)
输出数: 1
内部驱动器:
类型 - 主要: 背光,闪灯/白光
类型 - 次要: 白色 LED
频率: 900kHz ~ 1.15MHz
电源电压: 2.7 V ~ 5.5 V
输出电压: 5.15V
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
供应商设备封装: 10-DFN(3x3)
包装: 管件
工作温度: -40°C ~ 85°C
LTC3454
APPLICATIONS INFORMATION
LED Failure Modes
If the LED fails as an open circuit, the safety ampli?er takes
control of the regulation loop to prevent V OUT runaway.
The V OUT threshold at which this occurs is about 5.15V.
The safety ampli?er has no effect on loop regulation at
V OUT less than 5.15V.
If the LED fails as a short-circuit, the current limiting
circuitry detects this condition and limits the peak input
current to a safe level.
V IN
ENx
LTC3454
V OUT
V IN
ENx
LTC3454
V OUT
I SETx
LED
I SETx
LED
VOLTAGE
DAC
R SET ≥ R MIN
V DAC
I LED = 3850
0.8V – V DAC
R SET
CURRENT
DAC
IDAC ≤
0.8V
R MIN
I LED = 3850 ? IDAC
(3a)
(3b)
V IN
ENx
LTC3454
V OUT
V IN
ENx
LTC3454
V OUT
I SETx
LED
I SETx
LED
R MIN
I LED = 3850
0.8V
R MIN + R POT
R SET
100
R SET ≥ R MIN
I LED = 3850
0.8V – V PWM
R SET
R POT
V PWM
= 3850
0.8V – (DC% ? V DVCC )
R SET
DV CC
f PWM ≥ 10kHz
(3c)
(3d)
3454 F03
Figure 3. Brightness Control Methods: (a) Using Voltage DAC, (b) Using Current DAC, (c) Using Potentiometer, (d) Using PWM Input
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 0.05
R = 0.115
TYP
6
10
0.38
0.10
3.50 0.05 1.65 0.05
2.15 0.05 (2 SIDES)
PACKAGE
OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
3.00 0.10
(4 SIDES)
1.65 0.10
(2 SIDES)
5
1
(DD) DFN 1103
0.25
0.05
0.50
BSC
2.38 0.05
0.200 REF
0.75 0.05
0.00 – 0.05
2.38 0.10
(2 SIDES)
0.25 0.05
0.50 BSC
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
BOTTOM VIEW—EXPOSED PAD
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3454fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
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