参数资料
型号: LTC3527EUD#TRPBF
厂商: Linear Technology
文件页数: 20/22页
文件大小: 0K
描述: IC REG BOOST SYNC ADJ DL 16QFN
标准包装: 2,500
类型: 升压(升压)
输出类型: 可调式
输出数: 2
输出电压: 1.6 V ~ 5.25 V
输入电压: 0.5 V ~ 5 V
PWM 型: 电流模式,混合
频率 - 开关: 1.2MHz,2.2MHz
电流 - 输出: 400mA,800mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 16-QFN-EP(3x3)
LTC3527/LTC3527-1
PACKAGE DESCRIPTION
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.70 ± 0.05
3.50 ± 0.05
1.45 ± 0.05
2.10 ± 0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
3.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
R = 0.115
TYP
15
16
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45 ° CHAMFER
PIN 1
TOP MARK
(NOTE 6)
1.45 ± 0.10
0.40 ± 0.10
1
2
(4-SIDES)
(UD16) QFN 0904
0.200 REF
0.00 – 0.05
0.25 ± 0.05
0.50 BSC
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
35271fc
20
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