参数资料
型号: LTC3529EDCB#TRPBF
厂商: Linear Technology
文件页数: 9/12页
文件大小: 0K
描述: IC REG BOOST SYNC 5V 1.5A 8DFN
标准包装: 2,500
类型: 升压(升压)
输出类型: 固定
输出数: 1
输出电压: 5V
输入电压: 1.8 V ~ 5.25 V
PWM 型: 电流模式
频率 - 开关: 1.5MHz
电流 - 输出: 1.5A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 8-DFN(3x2)
LTC3529
APPLICATIONS INFORMATION
Inductor Selection
The LTC3529 can utilize small surface-mount chip induc-
tors due to its fast 1.5MHz switching frequency. Larger
values of inductance will allow slightly greater output
current capability by reducing the inductor ripple current.
Increasing the inductance above 10μH will increase com-
ponent size while providing little improvement in output
current capability.
USB On-The-Go speci?cations limit output capacitance to
6.5μF. When using a 6.5μF output capacitance, a 4.7μH
inductor must be used to maintain stability. Larger induc-
tors may be used with larger output capacitors.
The minimum inductance value for a given allowable induc-
tor ripple Δ I (in Amps peak-to-peak) is given by:
PCB Layout Guidelines
The LTC3529 switches large currents at high frequencies.
Special care should be given to the PCB layout to ensure
stable, noise-free operation. Figure 1 depicts the recom-
mended PCB layout to be utilized for the LTC3529. A few
key guidelines follow:
1. All circulating current paths should be kept as short
as possible. This can be accomplished by keeping the
copper traces to all components in Figure 1 short and
wide. Capacitor ground connections should via down
to the ground plane in the shortest route possible. The
bypass capacitors on V IN and V OUT should be placed
close to the IC and should have the shortest possible
paths to ground.
V IN ( MIN ) ? ( V OUT IN ( MIN )
L >
– V
Δ I ? f ? V OUT
) μH
2. The PGND pin should be shorted directly to the ex-
posed pad, as shown in Figure 1. This provides a single
point connection between the small signal ground and
where V IN(MIN) is the minimum input voltage, f is the
operating frequency in MHz (1.5MHz Typ), and V OUT is
the output voltage (5V).
The inductor current ripple is typically set for 20% to 40%
of the maximum inductor current (I P ). High frequency
ferrite core inductor materials reduce frequency depen-
dent power losses compared to cheaper powdered iron
cores, improving ef?ciency. To achieve high ef?ciency, a
low ESR inductor should be utilized. The inductor must
have a saturation current rating greater than the worst
case average inductor current plus half the ripple current.
Molded chokes and some chip inductors usually do not have
enough core to support peak LTC3529 inductor currents.
the power ground, as well as a wide trace for power
ground.
3. All the external components shown in Figure 1 and their
connections should be placed over a complete ground
plane.
4. Use of multiple vias in the die attach pad will enhance
the thermal environment of the converter, especially if
the vias extend to a ground plane region on the exposed
bottom surface or inner layers of the PCB.
To minimize radiated noise, use a shielded inductor. See
Table 2 for suggested components and suppliers.
Table 2. Representative Surface Mount Inductors
MAX
V OUT 1
SW 2
SHDN 3
PGND 4
8 V IN
7 RST
6 SNSGND
5 FAULT
MANUFACTURER PART NUMBER VALUE CURRENT
(μH) (A)
Sumida CDRH5D16NP 4.7 2.15
DCR
( Ω )
0.064
HEIGHT
(mm)
1.8
MULTIPLE VIAs
TO GROUND PLANE
TDK
Coilcraft
VLF5014S
MSS6122
4.7
4.7
2
1.82
0.098
0.065
1.4
2.2
Figure 1. LTC3529 Recommended PCB Layout
Cooper Bussmann SD25-4R7
4.7
2.3
0.043
2.5
3529fb
9
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