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参数资料
| 型号： | LTC3530EMS#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 15/16页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK BST SYNC 0.6A 10MSOP |
| 标准包装： | 2,500 |
| 类型： | 降压（降压），升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 1.8 V ~ 5.25 V |
| 输入电压： | 1.8 V ~ 5.5 V |
| PWM 型： | Burst Mode? |
| 频率 - 开关： | 300kHz ~ 2MHz |
| 电流 - 输出： | 600mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 10-MSOP |
LTC3530
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1695)
0.675 ±0.05
R = 0.115
TYP
6
10
0.38 ± 0.10
3.50 ±0.05
1.65 ±0.05
3.00 ±0.10
1.65 ± 0.10
2.15 ±0.05
(2 SIDES)
PIN 1
(4 SIDES)
(2 SIDES)
TOP MARK
(SEE NOTE 6)
5
1
(DD10) DFN 1103
0.25 ± 0.05
0.50
BSC
PACKAGE
OUTLINE
0.200 REF
0.75 ±0.05
2.38 ± 0.10
0.25 ± 0.05
0.50 BSC
NOTE:
2.38 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889 ± 0.127
(.035 ± .005)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
1 0 9 8 7 6
0.497 ± 0.076
(.0196 ± .003)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.254
(.010)
DETAIL “A”
0 ° – 6 ° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.305 ± 0.038 0.50
(.0120 ± .0015) (.0197)
TYP BSC
RECOMMENDED SOLDER PAD LAYOUT
GAUGE PLANE
0.18
(.007)
DETAIL “A”
0.53 ± 0.152
(.021 ± .006)
1 2 3 4 5
1.10
(.043)
MAX
0.86
(.034)
REF
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
BSC
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MS) 0307 REV E
3530fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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| LTC3531EDD#PBF | 功能描述:IC REG BUCK BOOST SYNC ADJ 8DFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:250 系列:- 类型:降压（降压） 输出类型:固定 输出数:1 输出电压:1.2V 输入电压:2.05 V ~ 6 V PWM 型:电压模式 频率 - 开关:2MHz 电流 - 输出:500mA 同步整流器:是 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:6-UFDFN 包装:带卷 (TR) 供应商设备封装:6-SON（1.45x1） 产品目录页面:1032 (CN2011-ZH PDF) 其它名称:296-25628-2 |
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