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参数资料
| 型号： | LTC3532EDD#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 15/16页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK BOOST SYNC ADJ 10DFN |
| 标准包装： | 121 |
| 类型： | 降压（降压），升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 2.4 V ~ 5.25 V |
| 输入电压： | 2.4 V ~ 5.5 V |
| PWM 型： | Burst Mode? |
| 频率 - 开关： | 300kHz ~ 2MHz |
| 电流 - 输出： | 500mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 包装： | 管件 |
| 供应商设备封装： | 10-DFN（3x3） |
| 产品目录页面： | 1335 (CN2011-ZH PDF) |
LTC3532
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ± 0.05
R = 0.115
TYP
6
10
0.38 ± 0.10
3.50 ± 0.05 1.65 ± 0.05
2.15 ± 0.05 (2 SIDES)
PACKAGE
PIN 1
TOP MARK
3.00 ± 0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
OUTLINE
(SEE NOTE 6)
5
1
(DD) DFN 1103
0.25 ± 0.05
0.50
0.200 REF
0.75 ± 0.05
0.25 ± 0.05
0.50 BSC
BSC
2.38 ± 0.10
2.38 ± 0.05
(2 SIDES)
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev E)
3.00 ± 0.102
0.889 ± 0.127
(.035 ± .005)
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
0.497 ± 0.076
(.0196 ± .003)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.254
(.010)
DETAIL “A”
0 ° – 6 ° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
GAUGE PLANE
0.305 ± 0.038 0.50
(.0120 ± .0015) (.0197)
TYP BSC
RECOMMENDED SOLDER PAD LAYOUT
DETAIL “A”
0.53 ± 0.152
(.021 ± .006)
1.10
(.043)
MAX
1 2 3 4 5
0.86
(.034)
REF
0.18
(.007)
SEATING
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MS) 0307 REV E
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
BSC
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3532fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC3532EDD-TRPBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:Micropower Synchronous Buck-Boost DC/DC Converter |
| LTC3532EMS | 制造商:Linear Technology 功能描述:Conv DC-DC Single Non-Inv/Inv/Step Up/Step Down 2.4V to 5.5V 10-Pin MSOP |
| LTC3532EMS#PBF | 功能描述:IC REG BUCK BST SYNC 0.5A 10MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:250 系列:- 类型:降压（降压） 输出类型:固定 输出数:1 输出电压:1.2V 输入电压:2.05 V ~ 6 V PWM 型:电压模式 频率 - 开关:2MHz 电流 - 输出:500mA 同步整流器:是 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:6-UFDFN 包装:带卷 (TR) 供应商设备封装:6-SON（1.45x1） 产品目录页面:1032 (CN2011-ZH PDF) 其它名称:296-25628-2 |
| LTC3532EMS#TR | 制造商:Linear Technology 功能描述:Conv DC-DC Single Non-Inv/Inv/Step Up/Step Down 2.4V to 5.5V 10-Pin MSOP T/R |
| LTC3532EMS#TRPBF | 功能描述:IC REG BUCK BST SYNC 0.5A 10MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:2,500 系列:- 类型:升压（升压） 输出类型:可调式 输出数:1 输出电压:1.24 V ~ 30 V 输入电压:1.5 V ~ 12 V PWM 型:电流模式，混合 频率 - 开关:600kHz 电流 - 输出:500mA 同步整流器:无 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) 供应商设备封装:8-SOIC |
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