参数资料
型号: LTC3537EUD#PBF
厂商: Linear Technology
文件页数: 4/22页
文件大小: 314K
描述: IC REG DL BST/LINEAR SYNC 16-QFN
标准包装: 121
拓扑: 升压(升压)同步(1),线性(LDO)(1)
功能: 任何功能
输出数: 2
频率 - 开关: 2.2MHz
电压/电流 - 输出 1: 1.5 V ~ 5.25 V,100mA
电压/电流 - 输出 2: 0.6 V ~ 5 V,100mA
带 LED 驱动器:
带监控器:
带序列发生器:
电源电压: 0.68 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
供应商设备封装: 16-QFN-EP(3x3)
包装: 管件
产品目录页面: 1335 (CN2011-ZH PDF)
LTC3537
4
3537fd
Note 1: Stresses beyond those listed under Absolute Maximum Ratings 
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3537 is guaranteed to meet performance speci cations 
from 0癈 to 85癈. Speci cations over the 40癈 to 85癈 operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 3: Speci cation is guaranteed by design and not 100% tested in 
production.
ELECTRICAL CHARACTERISTICS
 
The l denotes the speci cations which apply over the full operating
temperature range, otherwise speci cations are at T
A
 = 25癈. (Note 2) V
INL
 = 3.3V, V
OLDO
 = 3V, unless otherwise noted.
SYMBOL  PARAMETER
CONDITIONS
MIN   TYP   MAX   UNITS
PSRR    Ripple Rejection
f = 2.2MHz at I
LOAD
 = 100mA (Note 3)
24
dB
I
SHORT
Short Circuit Current Limit
V
OLDO
 = 0V
l   110   150
mA
V
ENLDOH
ENLDO Input High Voltage
0.8
V
V
ENLDOL
ENLDO Input Low Voltage
0.3
V
I
ENLDO
ENLDO Input Current
V
ENLDO
 = 5.5V
1.5
V
PGDLLOW
PGDL Voltage Low
I
PGDL
 = 5mA
200
mV
I
PGDLLEAK
PGDL Leakage Current
V
PGDL
 = 5.5V
0.01    1
PGDL Trip Point
V
FBL
 Rising
96
% V
OLDO
PGDL Hysteresis
3
%
Note 4: Current measurements are made when the output is not switching.
Note 5: This IC includes overtemperature protection that is intended 
to protect the device during momentary overload conditions. Junction
temperature will exceed 125癈 when overtemperature protection is active.
Continuous operation above the speci ed maximum operating junction
temperature may result in device degradation or failure.
Note 6: Failure to solder the exposed backside of the package to the PC 
board ground plane will result in a thermal resistance much higher than
68癈/W.
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