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参数资料
| 型号： | LTC3632IMS8E#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 20/22页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 20MA 8MSOP |
| 标准包装： | 2,500 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.8 V ~ 50 V |
| 输入电压： | 4.5 V ~ 50 V |
| PWM 型： | Burst Mode? |
| 电流 - 输出： | 20mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 8-MSOP-EP |
LTC3632
PACKAGE DESCRIPTION
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev I)
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88
1.88 ± 0.102
(.074 ± .004)
0.889 ± 0.127
(.035 ± .005)
1
(.074)
1.68
(.066)
0.29
REF
0.05 REF
5.23
(.206)
MIN
0.42 ± 0.038
(.0165 ± .0015)
TYP
1.68 ± 0.102 3.20 – 3.45
(.066 ± .004) (.126 – .136)
0.65
(.0256)
BSC
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8
8
7 6 5
DETAIL “B”
0.52
(.0205)
REF
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
DETAIL “A”
0 ° – 6 ° TYP
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
GAUGE PLANE
DETAIL “A”
0.53 ± 0.152
(.021 ± .006)
1.10
(.043)
MAX
1
2 3
4
0.86
(.034)
REF
0.18
(.007)
0.22 – 0.38
0.65
(.0256)
BSC
SEATING
PLANE
(.009 – .015)
TYP
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MS8E) 0910 REV I
3632fc
20
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