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参数资料
| 型号： | LTC3785EUF-1#TRPBF |
| 厂商： | LINEAR TECHNOLOGY CORP |
| 元件分类： | 稳压器 |
| 英文描述： | 3 A SWITCHING REGULATOR, 650 kHz SWITCHING FREQ-MAX, PQCC24 |
| 封装： | 4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD, QFN-24 |
| 文件页数： | 9/20页 |
| 文件大小： | 213K |
| 代理商： | LTC3785EUF-1#TRPBF |
LTC3785-1
17
37851fa
PC BOARD LAYOUT CHECKLIST
The basic PC board layout requires a dedicated ground
plane layer. Also, for high current, a multilayer board
provides heat sinking for power components.
The ground plane layer should not have any traces and
it should be as close as possible to the layer with power
MOSFETs.
Place CIN, switch A, switch B and D1 in one compact
area. Place COUT, switch C, switch D and D2 in one
compact area.
Use immediate vias to connect the components (includ-
ing the LTC3785-1’s GND/PGND pin) to the ground plane.
Use several large vias for each power component.
Use planes for VIN and VOUT to maintain good voltage
ltering and to keep power losses low.
Flood all unused areas on all layers with copper. Flooding
with copper will reduce the temperature rise of power
components. Connect the copper areas to any DC net
(VIN or GND). When laying out the printed circuit board,
the following checklist should be used to ensure proper
operation of the LTC3785-1.
Segregate the signal and power grounds. All small-signal
components should return to the GND pin at one point.
The sources of switch B and switch C should also con-
nect to one point at the GND of the IC.
Place switch B and switch C as close to the controller
as possible, keeping the PGND, BG and SW traces
short.
Keep the high dV/dT SW1, SW2, VBST1, VBST2, TG1 and
TG2 nodes away from sensitive small-signal nodes.
APPLICATIONS INFORMATION
The path formed by switch A, switch B, D1 and the CIN
capacitor should have short leads and PC trace lengths.
The path formed by switch C, switch D, D2 and the
COUT capacitor also should have short leads and PC
trace lengths.
The output capacitor (–) terminals should be connected
as close as possible to the (–) terminals of the input
capacitor.
Connect the VCC decoupling capacitor CVCC closely to
the VCC and PGND pins.
Connect the top driver boost capacitor CA closely to
the VBST1 and SW1 pins. Connect the top driver boost
capacitor CB closely to the VBST2 and SW2 pins.
Connect the input capacitors CIN and output capaci-
tors COUT close to the power MOSFETs. These capaci-
tors carry the MOSFET AC current in boost and buck
mode.
Connect FB and VSENSE pin resistive dividers to the (+)
terminals of COUT and signal ground. If a small VSENSE
decoupling capacitor is used, it should be as close as
possible to the LTC3785-1 GND pin.
Route ISVIN and ISSW1 leads together with minimum
PC trace spacing. Ensure accurate current sensing
with Kelvin connections across MOSFET A or sense
resistor.
Route ISVOUT and ISSW2 leads together with minimum
PC trace spacing. Ensure accurate current sensing
with Kelvin connections across MOSFET D or sense
resistor.
Connect the feedback network close to IC, between the
VC and FB pins.
相关PDF资料 |
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| LTC3785EUF-1#PBF | 3 A SWITCHING REGULATOR, 650 kHz SWITCHING FREQ-MAX, PQCC24 |
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| LTC3823EUH#TR | 4 A SWITCHING CONTROLLER, 200 kHz SWITCHING FREQ-MAX, PQCC32 |
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