参数资料
型号: LTC3853IUJ#TR
厂商: LINEAR TECHNOLOGY CORP
元件分类: 稳压器
英文描述: 0.15 A DUAL SWITCHING CONTROLLER, 830 kHz SWITCHING FREQ-MAX, PQCC40
封装: 6 X 6 MM, PLASTIC, QFN-40
文件页数: 19/36页
文件大小: 1780K
代理商: LTC3853IUJ#TR
LTC3853
26
3853fa
APPLICATIONS INFORMATION
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the IC. Figure 12 illustrates the current waveforms pres-
ent in the various branches of the 3-phase synchronous
regulators operating in the continuous mode. Check the
following in your layout:
1. Are the top N-channel MOSFETs located within 1 cm of
each other with a common drain connection at CIN? Do
not attempt to split the input decoupling for the three
channels as it can cause a large resonant loop.
2. Are the signal and power grounds kept separate? The
combined IC signal ground pin and the ground return
of CINTVCC must return to the combined COUT (–) ter-
minals. The VFB and ITH traces should be as short as
possible.ThepathformedbythetopN-channelMOSFET,
Schottky diode and the CIN capacitor should have short
leads and PC trace lengths. The output capacitor (–)
terminals should be connected as close as possible
to the (–) terminals of the input capacitor by placing
the capacitors next to each other and away from the
Schottky loop described above.
3. Do the LTC3853 VFB pins’ resistive dividers connect to
the (+) terminals of COUT? The resistive divider must be
connected between the (+) terminal of COUT and signal
ground. The feedback resistor connections should not
be along the high current input feeds from the input
capacitor(s).
4. Are the SENSE+ and SENSEleads routed together with
minimumPCtracespacing?Thefiltercapacitorbetween
SENSE+ and SENSEshould be as close as possible
to the IC. Ensure accurate current sensing with Kelvin
connectionsatthesenseresistororinductor,whichever
is used for current sensing.
5. Is the INTVCC decoupling capacitor connected close to
the IC, between the INTVCC and the power ground pins?
ThiscapacitorcarriestheMOSFETdriverscurrentpeaks.
Anadditional1Fceramiccapacitorplacedimmediately
next to the INTVCC and PGND pins can help improve
noise performance substantially.
6. Keep the switching nodes (SW), top gate nodes (TG),
and boost nodes (BOOST) away from sensitive small-
signal nodes, especially from another channel’s voltage
and current sensing feedback pins. All of these nodes
have very large and fast moving signals and therefore
should be kept on the “output side” of the LTC3853
and occupy minimum PC trace area. If DCR sensing
is used, place the top resistor (Figure 2b, R1) close to
the switching node.
7. Use a modified “star ground” technique: a low imped-
ance, large copper area central grounding point on
the same side of the PC board as the input and output
capacitors with tie-ins for the bottom of the INTVCC
decouplingcapacitor,thebottomofthevoltagefeedback
resistive divider and the SGND pin of the IC.
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