参数资料
型号: LTC3890MPUH#PBF
厂商: Linear Technology
文件页数: 30/40页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM CM 32-QFN
标准包装: 73
系列: PolyPhase®
PWM 型: 电流模式
输出数: 2
频率 - 最大: 850kHz
占空比: 99%
电源电压: 4 V ~ 60 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -55°C ~ 150°C
封装/外壳: 32-WFQFN 裸露焊盘
包装: 管件
LTC3890
APPLICATIONS INFORMATION
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the IC. These items are also illustrated graphically in the
layout diagram of Figure 11. Figure 12 illustrates the current
waveforms present in the various branches of the 2-phase
synchronous regulators operating in the continuous mode.
Check the following in your layout:
1. Are the top N-channel MOSFETs MTOP1 and MTOP2
located within 1cm of each other with a common drain
connection at C IN ? Do not attempt to split the input
decoupling for the two channels as it can cause a large
resonant loop.
2. Are the signal and power grounds kept separate? The
combined IC signal ground pin and the ground return
of C INTVCC must return to the combined C OUT (–) ter-
minals. The path formed by the top N-channel MOSFET,
Schottky diode and the C IN capacitor should have short
leads and PC trace lengths. The output capacitor (–)
terminals should be connected as close as possible
to the (–) terminals of the input capacitor by placing
the capacitors next to each other and away from the
Schottky loop described above.
3. Do the LTC3890 V FB pins’ resistive dividers connect to
the (+) terminals of C OUT ? The resistive divider must be
connected between the (+) terminal of C OUT and signal
ground. The feedback resistor connections should not
be along the high current input feeds from the input
capacitor(s).
4. Are the SENSE – and SENSE + leads routed together with
minimum PC trace spacing? The filter capacitor between
SENSE + and SENSE – should be as close as possible
to the IC. Ensure accurate current sensing with Kelvin
connections at the SENSE resistor.
5. Is the INTV CC decoupling capacitor connected close
to the IC, between the INTV CC and the power ground
pins? This capacitor carries the MOSFET drivers’ cur-
rent peaks. An additional 1μF ceramic capacitor placed
immediately next to the INTV CC and PGND pins can help
improve noise performance substantially.
6. Keep the switching nodes (SW1, SW2), top gate nodes
(TG1, TG2), and boost nodes (BOOST1, BOOST2) away
from sensitive small-signal nodes, especially from
the opposites channel’s voltage and current sensing
feedback pins. All of these nodes have very large and
fast moving signals and therefore should be kept on
the output side of the LTC3890 and occupy minimum
PC trace area.
7. Use a modified star ground technique: a low impedance,
large copper area central grounding point on the same
side of the PC board as the input and output capacitors
with tie-ins for the bottom of the INTV CC decoupling
capacitor, the bottom of the voltage feedback resistive
divider and the SGND pin of the IC.
3890fc
30
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