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参数资料
| 型号： | LTC4080EMSE |
| 厂商： | LINEAR TECHNOLOGY CORP |
| 元件分类： | 稳压器 |
| 英文描述： | 0.8 A BATTERY CHARGE CONTROLLER, 2750 kHz SWITCHING FREQ-MAX, PDSO10 |
| 封装： | PLASTIC, MSOP-10 |
| 文件页数： | 11/20页 |
| 文件大小： | 288K |
| 代理商： | LTC4080EMSE |
LTC4080
19
4080fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MSOP (MSE) 0307 REV B
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
12 3 45
4.90
± 0.152
(.193
± .006)
0.497
± 0.076
(.0196
± .003)
REF
8
9
10
1
7 6
3.00
± 0.102
(.118
± .004)
(NOTE 3)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
± 0.038
(.0120
± .0015)
TYP
2.083
± 0.102
(.082
± .004)
2.794
± 0.102
(.110
± .004)
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83
± 0.102
(.072
± .004)
2.06
± 0.102
(.081
± .004)
0.1016
± 0.0508
(.004
± .002)
PACKAGE DESCRIPTIO
U
DD Package
10-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1699)
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
2.38
±0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1103
0.25
± 0.05
2.38
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±0.05
(2 SIDES)
2.15
±0.05
0.50
BSC
0.675
±0.05
3.50
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev B)
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