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参数资料
| 型号： | LTC4225IUFD-2#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 22/24页 |
| 文件大小： | 346K |
| 描述： | IC CTLR HOT SWAP DUAL 24-QFN |
| 标准包装： | 2,500 |
| 类型： | 热交换控制器 |
| 应用： | 通用 |
| 内部开关： | 无 |
| 电流限制： | 可调 |
| 电源电压： | 2.9 V ~ 18 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 供应商设备封装： | 24-QFN（5x4） |
| 包装： | 带卷 (TR) |
LTC4225-1/LTC4225-2
22
422512f
package DescripTion
UFD Package
24-Lead Plastic QFN (4mm ?/SPAN> 5mm)
(Reference LTC DWG # 05-08-1696 Rev A)
4.00 ?0.10
(2 SIDES)
5.00 ?0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ?0.10
23 24
1
2
BOTTOM VIEWEXPOSED PAD
0.75 ?0.05
R = 0.115
TYP
R = 0.05 TYP
PIN 1 NOTCH
R = 0.20 OR C = 0.35
0.25 ?0.05
0.50 BSC
0.200 REF
0.00 0.05
(UFD24) QFN 0506 REV A
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ?.05
0.25 ?.05
0.50 BSC
2.65 ?0.05
2.00 REF
3.00 REF
4.10 ?0.05
5.50 ?0.05
3.10 ?0.05
4.50 ?0.05
PACKAGE OUTLINE
2.65 ?0.10
2.00 REF
3.00 REF
3.65 ?0.10
3.65 ?0.05
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