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参数资料
| 型号： | LTC4301IDD#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 1/12页 |
| 文件大小： | 223K |
| 描述： | IC BUFFER BUS HOTSWAP 2WR 8DFN |
| 标准包装： | 2,500 |
| 类型： | 热交换开关 |
| 应用： | 通用型缓冲器/总线扩展器 |
| 内部开关： | 是 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WFDFN 裸露焊盘 |
| 供应商设备封装： | 8-DFN-EP（3x3） |
| 包装： | 带卷 (TR) |
1
LTC4301
4301fb
FEATURES
DESCRIPTIO
APPLICATIO S
TYPICAL APPLICATIO
Supply Independent Hot
Swappable 2-Wire Bus Buffer
?/DIV>
Allows Bus Pull-Up Voltages Above or Below V
CC
?/DIV>
Bidirectional Buffer* for SDA and SCL Lines
Increases Fanout
?/DIV>
Prevents SDA and SCL Corruption During Live Board
Insertion and Removal from Backplane
?/DIV>
Isolates Input SDA and SCL Line from Output
?/DIV>
10kV Human Body Model ESD Protection
?/DIV>
1V Precharge On All SDA and SCL Lines
?/DIV>
Supports Clock Stretching, Arbitration and
Synchronization
?/DIV>
High Impedance SDA, SCL Pins for V
CC
= 0V
?/DIV>
CS Gates Connection from Input to Output
?/DIV>
Compatible with I
2
C
TM
, I
2
C Fast Mode and SMBus
Standards (Up to 400kHz Operation)
?/DIV>
Small 8-Pin MSOP and DFN (3mm ?3mm) Packages
?/DIV>
Hot Board Insertion
?/DIV>
Servers
?/DIV>
Capacitance Buffer/Bus Extender
?/DIV>
Desktop Computers
?/DIV>
CompactPCI
TM
and ATCA Systems
The LTC
?/DIV>
4301 supply independent, hot swappable, 2-wire
bus buffer allows I/O card insertion into a live backplane
without corruption of the data and clock busses. In addi-
tion, the LTC4301 allows the V
CC
, SDAIN and SCLIN pull-
up voltage and the SDAOUT and SCLOUT pull-up voltage
to be independent from each other. Control circuitry
prevents the backplane from being connected to the card
until a stop bit or a bus idle is present. When the connec-
tion is made, the LTC4301 provides bidirectional buffer-
ing, keeping the backplane and card capacitances isolated.
During insertion, the SDA and SCL lines are precharged to
1V to minimize bus disturbances. When driven low, the CS
input pin allows the part to connect after a stop bit or bus
idle occurs. Driving CS high breaks the connection be-
tween SCLIN and SCLOUT and between SDAIN and
SDAOUT. The READY output pin indicates that the back-
plane and card sides are connected together.
The LTC4301 is offered in 8-pin DFN (3mm ?3mm) and
MSOP packages.
10k
10k
5V
BACK_SCL
BACKPLANE
CONNECTOR
CARD
BACK_SDA
3.3V
10k
5V
CS
CARD_SCL
CARD_SDA
SCLOUT
SCLIN
SDAOUT
SDAIN
GND
V
CC
LTC4301
READY
0.01礔
4301 TA01
10k 10k
Input-Output Connection
4301 TA01b
OUTPUT
SIDE
20pF
INPUT
SIDE
55pF
1祍/DIV
1V/DIV
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 7032051.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTC4301IMS8 | 功能描述:IC BUFFER BUS HOTSWAP 2WR 8MSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
| LTC4301IMS8#PBF | 功能描述:IC BUFFER BUS HOTSWAP 2WR 8MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
| LTC4301IMS8#TR | 功能描述:IC BUFFER BUS HOTSWAP 2WR 8MSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
| LTC4301IMS8#TRPBF | 功能描述:IC BUFFER BUS HOTSWAP 2WR 8MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
| LTC4301LCDD | 功能描述:IC BUFFER BUS HOTSWAP 2WR 8DFN RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统，AdvancedTCA ? 系统，高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP，10-MSOP（0.118"，3.00mm 宽） 供应商设备封装:10-MSOP 包装:管件 |
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