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参数资料
| 型号： | LTC6102HVIMS8 |
| 厂商： | LINEAR TECHNOLOGY CORP |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO8 |
| 封装： | PLASTIC, MSOP-8 |
| 文件页数： | 16/24页 |
| 文件大小： | 277K |
| 代理商： | LTC6102HVIMS8 |
LTC6102
LTC6102-1/LTC6102HV
23
6102fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698)
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
0.10
(2 SIDES)
0.75 0.05
R = 0.115
TYP
2.38 0.10
(2 SIDES)
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25
0.05
2.38 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
(2 SIDES)
2.15 0.05
0.50
BSC
0.675 0.05
3.5 0.05
PACKAGE
OUTLINE
0.25
0.05
0.50 BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53
0.152
(.021
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
0.0508
(.004
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
0.152
(.193
.006)
8
7 6 5
3.00
0.102
(.118
.004)
(NOTE 3)
3.00
0.102
(.118
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
0.038
(.0165
.0015)
TYP
0.65
(.0256)
BSC
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相关代理商/技术参数 |
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| LTC6102HVIMS8#PBF | 功能描述:IC AMP CURRENT SENSE 8-MSOP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:1 系列:MicroAmplifier™ 放大器类型:通用 电路数:4 输出类型:- 转换速率:3.5 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:5pA 电压 - 输入偏移:1500µV 电流 - 电源:220µA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):4.5 V ~ 36 V，±2.25 V ~ 18 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-SOIC（0.154"，3.90mm 宽） 供应商设备封装:14-SOIC 包装:剪切带 (CT) 其它名称:296-29363-1 |
| LTC6102HVIMS8#TRPBF | 功能描述:IC AMP CURRENT SENSE 8-MSOP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 放大器类型:电流检测 电路数:1 输出类型:- 转换速率:- 增益带宽积:125kHz -3db带宽:- 电流 - 输入偏压:- 电压 - 输入偏移:100µV 电流 - 电源:1.1µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:4-WFBGA，CSPBGA 供应商设备封装:4-UCSP（2x2） 包装:剪切带 (CT) 其它名称:MAX9634WERS+TCT |
| LTC6102HVIMS8-PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:Precision Zero Drift Current Sense Amplifi er |
| LTC6102HVIMS8-TRPBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:Precision Zero Drift Current Sense Amplifi er |
| LTC6102IDD | 制造商:Linear Technology 功能描述:SP Amp Current Sense Amp Single 60V 8-Pin DFN EP |
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