参数资料
型号: LTC6404IUD-2#TRPBF
厂商: Linear Technology
文件页数: 9/28页
文件大小: 0K
描述: IC AMP/DRIVER DIFF 16-QFN
标准包装: 2,500
类型: ADC 驱动器
应用: 数据采集
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
供应商设备封装: 16-QFN-EP(3x3)
包装: 带卷 (TR)
LTC6404
17
6404f
PIN FUNCTIONS
potential. On the LTC6404-2, the VOCM pin has a input
resistance of approximately 14k. On the LTC6404-4, the
VOCM pin has a input resistance of approximately 7k. The
VOCM pin should be bypassed with a high quality ceramic
bypass capacitor of at least 0.01μF, (unless you are using
split supplies, then connect directly to a low impedance,
low noise ground plane) to minimize common mode noise
from being converted to differential noise by impedance
mismatches both externally and internally to the IC.
NC (Pins 5, 16): No Connection. These pins are not con-
nected internally.
OUT+, OUT(Pins 7, 14):
Unltered Output Pins. Besides
driving the feedback network, each pin can drive an ad-
ditional 50
Ω to ground with typical short-circuit current
limiting of ±65mA. Each amplier output is designed to
drive a load capacitance of 10pF. This basically means
the amplier can drive 10pF from each output to ground
or 5pF differentially. Larger capacitive loads should be
decoupled with at least 25
Ω resistors in series with each
output. For long-term device reliability, it is recommended
that the continuous (DC + ACRMS) output current be limited
to under 50mA.
OUTF+, OUTF(Pins 8, 13):
Filtered Output Pins. These
pins have a series 50
Ω resistor connected between the
ltered and unltered outputs and three 12pF capacitors.
Both OUTF+ and OUTFhave 12pF to V, plus an additional
12pF differentially between OUTF+ and OUTF. This lter
creates a differential lowpass frequency response with
a –3dB bandwidth of 88.5MHz. For long-term device
reliability, it is recommended that the continuous (DC +
ACRMS) output current be limited to under 40mA.
IN+, IN(Pins 15, 6):
Noninverting and Inverting Input Pins
of the Amplier, Respectively. For best performance, it is
highly recommended that stray capacitance be kept to an
absolute minimum by keeping printed circuit connections
as short as possible, and if necessary, stripping back nearby
surrounding ground plane away from these pins.
Exposed Pad (Pin 17): Tie the pad to V(Pins 3, 9, and 12).
If split supplies are used, do not tie the pad to ground.
BLOCK DIAGRAM
+
1
5
NC
6
IN
7
OUT+
8
OUTF+
16
NC
15
IN+
14
OUT
13
OUTF
2
V+
3
V
V+
V
V+
50Ω
12pF
66k
V
4
VOCM
12
V
6404 BD
11
V+
10
V+
9
V
50Ω
2 RVOCM
V
V+
V
V+
V
V+
V
V+
V
V+
V
SHDN
IC
LTC6404-1
LTC6404-2
LTC6404-4
2 RVOCM
47k
28k
14k
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