参数资料
型号: LTC6405IUD#TRPBF
厂商: Linear Technology
文件页数: 17/26页
文件大小: 0K
描述: IC DIFF AMP/DRIVER R-R 16-QFN
标准包装: 2,500
类型: ADC 驱动器
应用: 数据采集
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
供应商设备封装: 16-QFN-EP(3x3)
包装: 带卷 (TR)
LTC6405
24
6405fb
For more information www.linear.com/6405
3.00
±0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45
±0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
±0.10
BOTTOM VIEW—EXPOSED PAD
1.45
± 0.10
(4-SIDES)
0.75
±0.05
R = 0.115
TYP
0.25
±0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25
× 45° CHAMFER
15 16
2
0.50 BSC
0.200 REF
2.10
±0.05
3.50
±0.05
0.70
±0.05
0.00 – 0.05
(UD16) QFN 0904
0.25
±0.05
0.50 BSC
PACKAGE OUTLINE
UD Package
16-Lead Plastic QFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1691 Rev )
package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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