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参数资料
| 型号： | LTM4602EV#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 16/24页 |
| 文件大小： | 0K |
| 描述： | IC DC/DC UMODULE 6A 104-LGA |
| 产品培训模块： | Power Module vs. Discrete DC to DC |
| 软件下载： | LTM4602 Spice Models |
| 产品目录绘图： | LTM Series_15x15x2.8 |
| 设计资源： | LTM4602EV#PBF Footprint.bxl |
| 特色产品： | μModule Products |
| 标准包装： | 119 |
| 系列： | µModule® |
| 类型： | 非隔离（POL） |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 4.5V |
| 电压 - 输入（最大）： | 20V |
| Voltage - Output 1： | 0.6 ~ 5 V |
| 电流 - 输出（最大）： | 6A |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 104-LGA |
| 尺寸/尺寸： | 0.59" L x 0.59" W x 0.11" H（15.0mm x 15.0mm x 2.8mm） |
| 包装： | 托盘 |
| 工作温度： | -40°C ~ 85°C |
| 效率： | 92% |
| 产品目录页面： | 2711 (CN2011-ZH PDF) |
LTM4602
APPLICATIONS INFORMATION
7
6
5
4
3
2
7
6
5
4
3
2
1
0
0LFM
200LFM
400LFM
1
0
0LFM
200LFM
400LFM
50
60
70
80
90
100
50
60
70
80
90
100
Table 3. 1.5V Output
TEMPERATURE ( ° C)
4602 F16
Figure 16. 12V to 3.3V, No Heat Sink
TEMPERATURE ( ° C)
4602 F16
Figure 17. 12V to 3.3V, BGA Heat Sink
Table 4. 3.3V Output
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θ JA (°C/W)
15.2
14
12
13.9
11.3
10.25
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θ JA (°C/W)
15.2
14.6
13.4
13.9
11.1
10.5
Layout Checklist/Example
The high integration of the LTM4602 makes the PCB board
layout very simple and easy. However, to optimize its electri-
cal and thermal performance, some layout considerations
are still necessary.
? Use large PCB copper areas for high current path,
including V IN , PGND and V OUT . It helps to minimize the
PCB conduction loss and thermal stress.
? Place high frequency ceramic input and output capaci-
tors next to the V IN , PGND and V OUT pins to minimize
high frequency noise.
? Place a dedicated power ground layer underneath
the unit.
? To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
? Do not put vias directly on pads unless they are capped.
? Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
Figure 18 gives a good example of the recommended
layout.
LTM4602 Frequency Adjustment
The LTM4602 is designed to typically operate at 850kHz
across most input and output conditions. The control ar-
chitecture is constant on time valley mode current control.
The f ADJ pin is typically left open or decoupled with an
optional 1000pF capacitor. The switching frequency has
been optimized to maintain constant output ripple over the
operating conditions. The equations for setting the operat-
ing frequency are set around a programmable constant on
time. This on time is developed by a programmable current
into an on board 10pF capacitor that establishes a ramp
that is compared to a voltage threshold equal to the output
voltage up to a 2.4V clamp. This I ON current is equal to:
I ON = (V IN – 0.7V)/110k, with the 110k onboard resistor
4602fa
16
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTM4602HV | 制造商:LINER 制造商全称:Linear Technology 功能描述:6A, 28VIN High Effi ciency DC/DC μModule |
| LTM4602HVEV#PBF | 功能描述:IC DC/DC UMODULE 6A 104-LGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:66V 电压 - 输入（最大）:160V Voltage - Output 1:12V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:50W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9-FinMod 尺寸/尺寸:4.60" L x 1.86" W x 0.79" H（116.8mm x 47.2mm x 20.1mm） 包装:散装 工作温度:-25°C ~ 85°C 效率:* 电源（瓦特）- 最大:* |
| LTM4602HVEV#PBF | 制造商:Linear Technology 功能描述:DC/DC Converter IC 制造商:Linear Technology 功能描述:IC, STEP-DOWN DC/DC MODULE, LGA-104 |
| LTM4602HVEVPBF | 制造商:Linear Technology 功能描述:6A DC/DC uModule LTM4602 |
| LTM4602HVEV-PBF | 制造商:LINER 制造商全称:Linear Technology 功能描述:6A, 28VIN High Effi ciency DC/DC μModule |
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