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参数资料
| 型号： | LTM4606MPV#PBF |
| 厂商： | Linear Technology |
| 文件页数： | 19/28页 |
| 文件大小： | 0K |
| 描述： | IC DC/DC UMODULE 6A 133-LGA |
| 产品培训模块： | Wide Temperature DC/DC Converter µModules Power Module vs. Discrete DC to DC µModule® Family of EN55022 Class B Certified Regulators |
| 产品目录绘图： | LTM Series_15x15x2.8 |
| 特色产品： | μModule Products |
| 标准包装： | 119 |
| 系列： | µModule® |
| 类型： | 非隔离（POL） |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 4.5V |
| 电压 - 输入（最大）： | 28V |
| Voltage - Output 1： | 0.6 ~ 5 V |
| 电流 - 输出（最大）： | 6A |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 133-LGA |
| 尺寸/尺寸： | 0.59" L x 0.59" W x 0.11" H（15.0mm x 15.0mm x 2.8mm） |
| 包装： | 托盘 |
| 工作温度： | -55°C ~ 125°C |
| 效率： | 98% |
| 产品目录页面： | 2711 (CN2011-ZH PDF) |
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LTM4606
APPLICATIONS INFORMATION
Table 3. 1.5V Output
DERATING CURVE
Figures 8, 10
Figures 8, 10
Figures 8, 10
Figures 9, 11
Figures 9, 11
Figures 9, 11
V IN (V)
5, 12
5, 12
5, 12
5, 12
5, 12
5, 12
POWER LOSS CURVE
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θ JA (°C/W)
13.5
10
9
9.5
7
5
Table 4. 3.3V Output
DERATING CURVE
Figures 12, 14
Figures 12, 14
Figures 12, 14
Figures 13, 15
Figures 13, 15
Figures 13, 15
V IN (V)
12, 24
12, 24
12, 24
12, 24
12, 24
12, 24
POWER LOSS CURVE
Figure 7
Figure 7
Figure 7
Figure 7
Figure 7
Figure 7
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θ JA (°C/W)
13.5
11
10
10
7
5
Heat Sink Manufacturer
AAVID Thermalloy
Cool Innovations
PART NUMBER
375424B00034G
4-050503P to 4-050508P
WEBSITE
www.aavidthermalloy.com
www.cooinnovations.com
C IN
C IN
Layout Checklist/Example
The high integration of LTM4606 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con-
siderations are still necessary.
? Use large PCB copper areas for high current path, in -
cluding V IN , PGND and V OUT . It helps to minimize the
PCB conduction loss and thermal stress.
? Place high frequency ceramic input and output capaci -
tors next to the V D , PGND and V OUT pins to minimize
high frequency noise.
? Place a dedicated power ground layer underneath the
unit.
? Use a separated SGND ground copper area for com -
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
? Place one or more high frequency ceramic capacitors
close to the connection into the system board.
Figure 17 gives a good example of the recommended layout.
V IN
PGND
SIGNAL
GND
? Use round corners for the PCB copper layer to minimize
the radiated noise.
C OUT
C OUT
? To minimize the EMI noise and reduce module thermal
stress, use multiple vias for interconnection between
top layer and other power layers on different locations.
? Do not put vias directly on pads, unless they are capped.
V OUT
(LGA Shown, for BGA Use Circle Pads)
Figure 17. Recommended PCB Layout
4606 F17
4606fd
For more information www.linear.com/LTM4606
19
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LTM4606V | 制造商:LIN 功能描述:MODULE 133-LGA LINEAR, 0843 |
| LTM4607 | 制造商:LINER 制造商全称:Linear Technology 功能描述:High Effi ciency, Synchronous, 4-Switch Buck-Boost Controller |
| LTM4607EV#PBF | 功能描述:IC BUCK/BOOST SYNC ADJ 5A 141LGA RoHS:是 类别:电源 - 板载 >> DC DC Converters 系列:µModule® 设计资源:VI-200, VI-J00 Design Guide, Appl Manual 标准包装:1 系列:* 类型:隔离 输出数:1 电压 - 输入（最小）:66V 电压 - 输入（最大）:160V Voltage - Output 1:12V Voltage - Output 2:- Voltage - Output 3:- 电流 - 输出（最大）:* 电源（瓦） - 制造商系列:50W 电压 - 隔离:* 特点:* 安装类型:通孔 封装/外壳:9-FinMod 尺寸/尺寸:4.60" L x 1.86" W x 0.79" H（116.8mm x 47.2mm x 20.1mm） 包装:散装 工作温度:-25°C ~ 85°C 效率:* 电源（瓦特）- 最大:* |
| LTM4607EV#PBF | 制造商:Linear Technology 功能描述:DC/DC Converter IC |
| LTM4607EVPBF | 制造商:Linear Technology 功能描述:Conv DC-DC Step Up Step Down |
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