参数资料
型号: LTM4619IV#PBF
厂商: Linear Technology
文件页数: 17/24页
文件大小: 0K
描述: IC SWIT REG BUCK 4A ADJ 144LGA
产品培训模块: Power Module vs. Discrete DC to DC
软件下载: LTM4619 Spice Model
设计资源: DC1453A Design Files
LTM4619IV#PBF Footprint.bxl
特色产品: μModule Products
标准包装: 119
系列: µModule®
类型: 非隔离(POL)
输出数: 2
电压 - 输入(最小): 4.5V
电压 - 输入(最大): 26.5V
Voltage - Output 1: 0.8 ~ 5 V
Voltage - Output 2: 0.8 ~ 5 V
电流 - 输出(最大): 4A,4A
安装类型: 表面贴装
封装/外壳: 144-LGA
尺寸/尺寸: 0.59" L x 0.59" W x 0.11" H(15.0mm x 15.0mm x 2.8mm)
包装: 托盘
工作温度: -40°C ~ 125°C
产品目录页面: 2711 (CN2011-ZH PDF)
配用: DC1453A-ND - BOARD EVAL LTM4619
LTM4619
APPLICATIONS INFORMATION
Layout Checklist/Example
The high integration of LTM4619 makes the PCB board
layout very simple and easy. However, to optimize its electri-
cal and thermal performance, some layout considerations
are still necessary.
? Use large PCB copper areas for high current path, includ-
ing V IN , PGND, V OUT1 and V OUT2 . It helps to minimize
the PCB conduction loss and thermal stress.
? Place high frequency ceramic input and output capaci-
tors next to the V IN , PGND and V OUT pins to minimize
high frequency noise.
? To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnections
between top layer and other power layers.
? Do not put vias directly on the pads.
? Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
? Decouple the input and output grounds to lower the
output ripple noise.
Figure 17 gives a good example of the recommended layout.
? Place a dedicated power ground layer underneath the
unit.
TOP VIEW
PGND
C IN2
M
L
K
J
H
G
F
E
D
C
B
A
V IN
C IN1
PGND
1
2
3
4
5
6
7
8
9
10
11
12
C OUT2
C OUT1
V OUT2
PGND
V OUT1
Figure 17. Recommended PCB Layout
4619fb
For more information www.linear.com/LTM4619
17
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